Assignee
SILICON BANDWIDTH INC
US·32 granted patents·6 pending applications·722 citations·filing 1994–2006
Top patents by PatentIndex Score
38 records- 0196US6905367B2Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the sameSILICON BANDWIDTH INC·Filed 2002·Granted Jun 14, 2005·107 cites·75 claims
- 0290US6461197B2Female contact pin including flexible contact portionSILICON BANDWIDTH INC·Filed 2001·Granted Oct 8, 2002·47 cites·5 claims
- 0389US6663294B2Optoelectronic packaging assemblySILICON BANDWIDTH INC·Filed 2001·Granted Dec 16, 2003·43 cites·71 claims
- 0484US6577003B1Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2000·Granted Jun 10, 2003·25 cites·29 claims
- 0584USD430565SComputer cabinetSILICON BANDWIDTH INC·Filed 1997·Granted Sep 5, 2000·30 cites·1 claims
- 0683US7123465B2Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2004·Granted Oct 17, 2006·30 cites·21 claims
- 0783US6700138B2Modular semiconductor die package and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2002·Granted Mar 2, 2004·27 cites·21 claims
- 0882US6574726B2Modular architecture for high bandwidth computersSILICON BANDWIDTH INC·Filed 2000·Granted Jun 3, 2003·20 cites·20 claims
- 0981US6203347B1High-density electrical interconnect systemSILICON BANDWIDTH INC·Filed 1999·Granted Mar 20, 2001·27 cites·23 claims
- 1079US6305987B1Integrated connector and semiconductor die packageSILICON BANDWIDTH INC·Filed 1999·Granted Oct 23, 2001·32 cites·29 claims
- 1178US7070340B2High performance optoelectronic packaging assemblySILICON BANDWIDTH INC·Filed 2002·Granted Jul 4, 2006·20 cites·65 claims
- 1277US6603193B2Semiconductor packageSILICON BANDWIDTH INC·Filed 2001·Granted Aug 5, 2003·28 cites·47 claims
- 1377US6334794B1Electrical connector having staggered hold-down tabsSILICON BANDWIDTH INC·Filed 1999·Granted Jan 1, 2002·26 cites·18 claims
- 1476US6421254B2Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2001·Granted Jul 16, 2002·19 cites·20 claims
- 1575US6307258B1Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 1998·Granted Oct 23, 2001·38 cites·24 claims
- 1672US6797882B1Die package for connection to a substrateSILICON BANDWIDTH INC·Filed 2001·Granted Sep 28, 2004·16 cites·29 claims
- 1771US6339191B1Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 1994·Granted Jan 15, 2002·28 cites·150 claims
- 1867US6097086ASemiconductor chip carrier including an interconnect component interfaceSILICON BANDWIDTH INC·Filed 1999·Granted Aug 1, 2000·21 cites·21 claims
- 1967US6078102ASemiconductor die package for mounting in horizontal and upright configurationsSILICON BANDWIDTH INC·Filed 1998·Granted Jun 20, 2000·34 cites·35 claims
- 2064US6857173B1Apparatus for and method of manufacturing a semiconductor die carrierSILICON BANDWIDTH INC·Filed 2000·Granted Feb 22, 2005·9 cites·28 claims
- 2164US6847115B2Packaged semiconductor device for radio frequency shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 25, 2005·13 cites·15 claims
- 2263US6266246B1Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2000·Granted Jul 24, 2001·9 cites·12 claims
- 2362US7183646B2Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2003·Granted Feb 27, 2007·6 cites·17 claims
- 2462US6679733B2Electrical connector having electrically conductive shieldingSILICON BANDWIDTH INC·Filed 2001·Granted Jan 20, 2004·9 cites·20 claims
- 2560US6247972B1Electrical connector assembly with a female electrical connector having internal flexible contact armSILICON BANDWIDTH INC·Filed 1997·Granted Jun 19, 2001·17 cites·26 claims
- 2658US6803650B2Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2001·Granted Oct 12, 2004·11 cites·26 claims
- 2755US6475832B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2001·Granted Nov 5, 2002·5 cites·13 claims
- 2853US7135768B2Hermetic sealSILICON BANDWIDTH INC·Filed 2001·Granted Nov 14, 2006·7 cites·32 claims
- 2950US6828511B2Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 2001·Granted Dec 7, 2004·2 cites·9 claims
- 3050US2005280158A1Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 2005·Application pending·0 cites
- 3149US6709891B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2002·Granted Mar 23, 2004·5 cites·11 claims
- 3247US6734546B2Micro grid array semiconductor die packageSILICON BANDWIDTH INC·Filed 2002·Granted May 11, 2004·3 cites·13 claims
- 3342US2006279904A1Decoupling capacitor for an integrated circuit and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2006·Application pending·0 cites
- 3441US6141869AApparatus for and method of manufacturing a semiconductor die carrierSILICON BANDWIDTH INC·Filed 1998·Granted Nov 7, 2000·8 cites·29 claims
- 3541US2006282593A1Backplane system having high-density electrical connectorsSILICON BANDWIDTH INC·Filed 2006·Application pending·0 cites
- 3640US2004026757A1Modular semiconductor die package and method of manufacturing thereofSILICON BANDWIDTH INC·Filed 2003·Application pending·0 cites
- 3739US2004222514A1Semiconductor die package having mesh power and ground planesSILICON BANDWIDTH INC·Filed 2004·Application pending·0 cites
- 3837US2002019174A1Integrated connector and semiconductor die packageSILICON BANDWIDTH INC·Filed 2001·Application pending·0 cites
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