Assignee
PANDA PROJECT
US·20 granted patents·1,078 citations·filing 1994–1997
Top patents by PatentIndex Score
20 records- 0195US5821457ASemiconductor die carrier having a dielectric epoxy between adjacent leadsPANDA PROJECT·Filed 1997·Granted Oct 13, 1998·230 cites·10 claims
- 0295US5543586AApparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1994·Granted Aug 6, 1996·167 cites·22 claims
- 0393US5637019AElectrical interconnect system having insulative shrouds for preventing mismatingPANDA PROJECT·Filed 1994·Granted Jun 10, 1997·86 cites·18 claims
- 0483US5696027AMethod of manufacturing a semiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1995·Granted Dec 9, 1997·46 cites·31 claims
- 0580US6050850AElectrical connector having staggered hold-down tabsPANDA PROJECT·Filed 1997·Granted Apr 18, 2000·30 cites·33 claims
- 0679US5541449ASemiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1994·Granted Jul 30, 1996·40 cites·26 claims
- 0778US6016256AMulti-chip module having interconnect diesPANDA PROJECT·Filed 1997·Granted Jan 18, 2000·44 cites·31 claims
- 0877US5659953AMethod of manufacturing an apparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1995·Granted Aug 26, 1997·45 cites·26 claims
- 0975US5941617ADecorative panel for computer enclosurePANDA PROJECT·Filed 1997·Granted Aug 24, 1999·34 cites·21 claims
- 1074US5781408AComputer system having a motorized door mechanismPANDA PROJECT·Filed 1996·Granted Jul 14, 1998·60 cites·23 claims
- 1173US6073229AComputer system having a modular architecturePANDA PROJECT·Filed 1997·Granted Jun 6, 2000·22 cites·23 claims
- 1273US6031720ACooling system for semiconductor die carrierPANDA PROJECT·Filed 1997·Granted Feb 29, 2000·47 cites·17 claims
- 1371US5951665AInterface optimized computer system architecturePANDA PROJECT·Filed 1997·Granted Sep 14, 1999·34 cites·37 claims
- 1470US5822551APassive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU boardPANDA PROJECT·Filed 1996·Granted Oct 13, 1998·38 cites·71 claims
- 1569US5819403AMethod of manufacturing a semiconductor chip carrierPANDA PROJECT·Filed 1995·Granted Oct 13, 1998·24 cites·78 claims
- 1669US5812797AComputer having a high density connector systemPANDA PROJECT·Filed 1996·Granted Sep 22, 1998·34 cites·8 claims
- 1766US5824950ALow profile semiconductor die carrierPANDA PROJECT·Filed 1995·Granted Oct 20, 1998·39 cites·32 claims
- 1857US5576931AComputer with two fans and two air circulation areasPANDA PROJECT·Filed 1994·Granted Nov 19, 1996·27 cites·32 claims
- 1951US5661631AComputer system having color-coded printed circuit boards and corresponding slatsPANDA PROJECT·Filed 1995·Granted Aug 26, 1997·24 cites·10 claims
- 2039US5791947AContact beam for electrical interconnect componentPANDA PROJECT·Filed 1995·Granted Aug 11, 1998·7 cites·20 claims
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