Inventor · disambiguated record
Yeuk-Fai Edwin Mok
Also filed as: MOK YEUK-FAI E · MOK YEUK-FAI EDWIN
12 granted patents·4 pending applications·740 citations·filing 1999–2008
94Inventor score
Top patents by PatentIndex Score
16 records- 0196US6516815B1Edge bead removal/spin rinse dry (EBR/SRD) moduleAPPLIED MATERIALS INC·Filed 1999·Granted Feb 11, 2003·332 cites·50 claims
- 0293US6824612B2Electroless plating systemAPPLIED MATERIALS INC·Filed 2001·Granted Nov 30, 2004·67 cites·24 claims
- 0389US6537011B1Method and apparatus for transferring and supporting a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Mar 25, 2003·68 cites·22 claims
- 0488US7138014B2Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Nov 21, 2006·37 cites·38 claims
- 0587US7223323B2Multi-chemistry plating systemAPPLIED MATERIALS INC·Filed 2003·Granted May 29, 2007·44 cites·1 claims
- 0684US6158384APlasma reactor with multiple small internal inductive antennasAPPLIED MATERIALS INC·Filed 1999·Granted Dec 12, 2000·56 cites·88 claims
- 0778US6178920B1Plasma reactor with internal inductive antenna capable of generating helicon waveAPPLIED MATERIALS INC·Filed 1999·Granted Jan 30, 2001·35 cites·29 claims
- 0877US6466426B1Method and apparatus for thermal control of a semiconductor substrateAPPLIED MATERIALS INC·Filed 1999·Granted Oct 15, 2002·57 cites·27 claims
- 0975US7319920B2Method and apparatus for self-calibration of a substrate handling robotAPPLIED MATERIALS INC·Filed 2003·Granted Jan 15, 2008·22 cites·27 claims
- 1067US7311810B2Two position anneal chamberAPPLIED MATERIALS INC·Filed 2004·Granted Dec 25, 2007·11 cites·25 claims
- 1165US6689418B2Apparatus for wafer rinse and clean and edge etchingAPPLIED MATERIALS INC·Filed 2001·Granted Feb 10, 2004·9 cites·23 claims
- 1250US6869516B2Method for removing electrolyte from electrical contacts and wafer touching areasAPPLIED MATERIALS INC·Filed 2002·Granted Mar 22, 2005·2 cites·19 claims
- 1347US2005199489A1Electroless deposition apparatusAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1440US2009182454A1Method and apparatus for self-calibration of a substrate handling robotDONOSO BERNARDO·Filed 2008·Application pending·0 cites
- 1536US2003034617A1Wafer chuck with plungerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 1635US2003213772A9Integrated semiconductor substrate bevel cleaning apparatus and methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →