Inventor · disambiguated record
Daisuke Uenda
Also filed as: UENDA DAISUKE
8 granted patents·19 pending applications·39 citations·filing 2000–2013
82Inventor score
Top patents by PatentIndex Score
27 records- 0183US7575812B2Cleaning substrate of substrate processing equipment and heat resistant resin preferable thereforNITTO DENKO CORP·Filed 2005·Granted Aug 18, 2009·7 cites·11 claims
- 0282US6798487B1Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layerNITTO DENKO CORP·Filed 2000·Granted Sep 28, 2004·19 cites·6 claims
- 0362US7793668B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2004·Granted Sep 14, 2010·5 cites·18 claims
- 0460US8841757B2Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor deviceUENDA DAISUKE·Filed 2011·Granted Sep 23, 2014·1 cites·7 claims
- 0560US2014090196A1Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipmentNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0658US2014090199A1Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipmentNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0755US6889432B2Method of manufacturing double-sided circuit boardNITTO DENKO CORP·Filed 2003·Granted May 10, 2005·7 cites·5 claims
- 0854US2009253891A1Cleaning substrate of substrate processing equipment and heat resistant resin preferable thereofNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 0951US2010319151A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKKO CORP·Filed 2010·Application pending·0 cites
- 1050US8475600B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2006·Granted Jul 2, 2013·0 cites·9 claims
- 1148US8524007B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2010·Granted Sep 3, 2013·0 cites·8 claims
- 1247US2014106133A1LaminateNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1346US2006105164A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1446US2004204334A1Cleaning sheet, carrying member with a cleaning function and method of cleaning substrate processing equipmentNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1544US2010175716A1Cleaning Member, Delivery Member with Cleaning Function, and Method of Cleaning Substrate Processing ApparatusNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1641US2014249269A1Thermally-detachable sheetNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1740US2014004637A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1840US2014004635A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1940US2014004636A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2040US2014000793A1Method of manufacturing an ledNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2140US2014004683A1Method of manufacturing semiconductor elementNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2240US2012042902A1Cleaning sheet, transfer member with cleaning function, cleaning method of substrate processing apparatus, and substrate processing apparatusUENDA DAISUKE·Filed 2010·Application pending·0 cites
- 2339US9147625B2Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Sep 29, 2015·0 cites·18 claims
- 2438US2007163621A1Cleaning member for semiconductor apparatus and process for producing the sameNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 2537US2012280706A1Cleaning sheet, cleaning member, cleaning method, and continuity test apparatusUENDA DAISUKE·Filed 2012·Application pending·0 cites
- 2636US2012126379A1Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond filmUENDA DAISUKE·Filed 2011·Application pending·0 cites
- 2736US2012126381A1Adhesive film for semiconductor device, and semiconductor deviceUENDA DAISUKE·Filed 2011·Application pending·0 cites
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