US2014004637A1PendingUtilityA1

Method of manufacturing an led

Assignee: NITTO DENKO CORPPriority: Jun 28, 2012Filed: Jun 13, 2013Published: Jan 2, 2014

Est. expiryJun 28, 2032(~5.9 yrs left)· nominal 20-yr term from priority

Inventors:Tomokazu Takahashi Shinya Akizuki Toshimasa Sugimura Takeshi Matsumura Daisuke Uenda

H10P 72/7442H10P 72/7422H10P 72/7416H10P 72/744H10P 72/742H10P 72/7402H10H 20/018H10H 20/841H10H 20/85H01L 33/46

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Claims

Abstract

A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.

Claims

exact text as granted — not AI-modified

1 . A method of manufacturing an LED, the method comprising:
 back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate;   forming, after the back-grinding, a reflective layer on an outer side of the substrate; and   attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.   
     
     
         2 . A method of manufacturing an LED according to  claim 1 , wherein the heat-resistant pressure-sensitive adhesive sheet comprises a hard base member and a pressure-sensitive adhesive layer. 
     
     
         3 . A method of manufacturing an LED according to  claim 1 ,
 wherein the back-grinding comprises the attaching of the heat-resistant pressure-sensitive adhesive sheet, and   wherein the LED wafer is subjected to the forming of the reflective layer under a state in which the heat-resistant pressure-sensitive adhesive sheet is still attached to the LED wafer.

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