Inventor · disambiguated record
Andreas Grassmann
Also filed as: GRASSMANN ANDREAS · GRASSMANN ANDREAS E
35 granted patents·18 pending applications·132 citations·filing 1997–2025
96Inventor score
Files withINFINEON TECHNOLOGIES AG41INFINEON TECHNOLOGIES AUSTRIA AG6HYUNDAI MOTOR CO LTD2SIEMENS AG2IBM1
Top patents by PatentIndex Score
53 records- 0193US10211133B2Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 19, 2019·8 cites·3 claims
- 0293US9275926B2Power module with cooling structure on bonding substrate for cooling an attached semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·22 cites·15 claims
- 0392US10128165B2Package with vertically spaced partially encapsulated contact structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 13, 2018·11 cites·25 claims
- 0492US9613885B2Plastic cooler for semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 4, 2017·8 cites·15 claims
- 0590US10586756B2Chip carrier configured for delamination-free encapsulation and stable sinteringINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 10, 2020·6 cites·22 claims
- 0688US9768766B2Electronic switching element and integrated sensorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Sep 19, 2017·8 cites·15 claims
- 0782US9589922B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·5 cites·5 claims
- 0879US9934990B2Method of manufacturing a cooler for semiconductor modulesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 3, 2018·2 cites·15 claims
- 0976US2025062290A1Power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1074US2024258216A1Power Module with Semiconductor Packages Mounted on Metal FrameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1172US12211824B2Power semiconductor package having first and second lead framesINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·15 claims
- 1272US2025054843A1Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing MethodINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1368US11862533B2Fluid-cooled package having shielding layerINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1467US11973012B2Power module with semiconductor packages mounted on metal frameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 1567US11574889B2Power module comprising two substrates and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 7, 2023·2 cites·12 claims
- 1667US2023361087A1Molded power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1766US10461017B2Package with partially encapsulated cooling channel for cooling an encapsulated chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·1 cites·15 claims
- 1866US9585241B2Substrate, chip arrangement, and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·2 cites·17 claims
- 1964US12165959B2Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 10, 2024·0 cites·8 claims
- 2064US6828181B2Dual gate material process for CMOS technologiesIBM·Filed 2003·Granted Dec 7, 2004·12 cites·20 claims
- 2163US10453771B2Package with roughened encapsulated surface for promoting adhesionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 22, 2019·1 cites·9 claims
- 2263US9370113B2Power semiconductor module with current sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 14, 2016·1 cites·21 claims
- 2362US2025293194A1Molded Electronic Component Having a Metallic Loops Embedded in a Mold CompoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2460US12261063B2Method and device for producing a housingINFINEON TECHNOLOGIES AG·Filed 2022·Granted Mar 25, 2025·0 cites·15 claims
- 2560US11908760B2Package with encapsulated electronic component between laminate and thermally conductive carrierINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 2660US2024387325A1Power electronic system including a semiconductor module and a cooler and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2759US2025054840A1Power module having a lead frame that provides substrate support and forms terminals of the power moduleINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2858US6063530AControl of critical dimensions through measurement of absorbed radiationSIEMENS AG·Filed 1997·Granted May 16, 2000·18 cites·1 claims
- 2957US10199238B2Semiconductor module cooling systemINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 5, 2019·0 cites·20 claims
- 3057US6162564AMask blank and method of producing maskTOSHIBA KK·Filed 1997·Granted Dec 19, 2000·15 cites·17 claims
- 3157US2023352378A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 3255US2024162129A1Substrate arrangement and methods for producing a substrate arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 3354US11171066B2Semiconductor panels, semiconductor packages, and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 3454US2019318976A1Cooling techniques for semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3553US2023035550A1Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height AdjustmentINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3653US2019157192A1Package with interconnections having different melting temperaturesINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 3752US10373890B1Cooling techniques for semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 3852US10304751B2Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframeINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 28, 2019·0 cites·18 claims
- 3952US9721863B2Printed circuit board including a leadframe with inserted packaged semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Aug 1, 2017·0 cites·15 claims
- 4051US11264356B2Batch manufacture of packages by sheet separated into carriers after mounting of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 1, 2022·0 cites·21 claims
- 4151US2024162205A1Power semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 4250US11244886B2Package cooled with cooling fluid and comprising shielding layerINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 8, 2022·0 cites·22 claims
- 4350US11056458B2Package comprising chip contact element of two different electrically conductive materialsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 6, 2021·0 cites·26 claims
- 4449US11598904B2Power semiconductor module and method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 7, 2023·0 cites·5 claims
- 4549US2022238413A1Double sided cooling module with power transistor submodulesINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 4647US2017154835A1Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 4746US11626351B2Semiconductor package with barrier to contain thermal interface materialINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 11, 2023·0 cites·15 claims
- 4845US10615097B2Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheetINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·0 cites·23 claims
- 4943US2025266312A1Power semiconductor assembly having an embedded power semiconductor die and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 5037US6025116AEtching of contact holesSIEMENS AG·Filed 1997·Granted Feb 15, 2000·6 cites·15 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →