Package with interconnections having different melting temperatures

Abstract

A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a second heat removal body mounted on or above the at least one electronic chip by a second interconnection, and an encapsulant encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body, wherein the first interconnection is configured to have another melting temperature than the second interconnection.

What is claimed is: 
     
         1 . A package, comprising:
 at least one electronic chip;   a first heat removal body on which the at least one electronic chip is mounted by a first interconnection;   a second heat removal body mounted on or above the at least one electronic chip by a second interconnection;   at least one electrically conductive spacer body between the at least one electronic chip and the second heat removal body;   a third interconnection which directly connects the at least one spacer body with the second heat removal body;   
       wherein the first interconnection, the second interconnection and the third interconnection are each configured to have different melting temperatures. 
     
     
         2 . The package according to  claim 1 , comprising an encapsulant encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body. 
     
     
         3 . The package according to  claim 1 , wherein the first interconnection comprises one of the group consisting of a solder structure and a sinter structure. 
     
     
         4 . The package according to  claim 1 , wherein the second interconnection comprises one of the group consisting of a solder structure and a sinter structure. 
     
     
         5 . The package according to  claim 1 , wherein the at least one electrically conductive spacer body comprises at least one electrically conductive and thermally conductive spacer body. 
     
     
         6 . The package according to  claim 1 , wherein the second interconnection directly connects the at least one electronic chip with the at least one spacer body. 
     
     
         7 . The package according to  claims 1 , wherein at least the first interconnection comprises Pb-based solder material or SnSb-based solder material. 
     
     
         8 . The package according to  claim 1 , wherein the third interconnection comprises one of the group consisting of a welding structure, a solder structure and a sinter structure. 
     
     
         9 . The package according to  claim 1 , wherein the third interconnection is configured to have a lower melting temperature than at least one of the first interconnection and the second interconnection. 
     
     
         10 . The package according to  claim 9 , wherein the second interconnection and the third interconnection is configured to have a lower melting temperature than the first interconnection. 
     
     
         11 . The package according to  claim 1 , wherein at least one of the second interconnection and the third interconnection comprises Pb-based material or Ag-based material. 
     
     
         12 . The package according to  claim 1 , wherein one of the first interconnection, the second interconnection and the third interconnection is configured to have a higher melting temperature than the other two of the first interconnection, the second interconnection and the third interconnection. 
     
     
         13 . The package according to  claim 1 , wherein two of the first interconnection ( 170 ), the second interconnection and the third interconnection are configured to have a higher melting temperature than the remaining one of the first interconnection, the second interconnection and the third interconnection. 
     
     
         14 . The package according to  claim 1 , configured for double-sided cooling. 
     
     
         15 . The package according to  claim 1 , wherein at least one of the first heat removal body and the second heat removal body comprises an electrically insulating layer having a first main surface covered by a first electrically conductive layer and having a second main surface covered by a second electrically conductive layer. 
     
     
         16 . The package according to  claim 1 , comprising an encapsulant encapsulating at least part of the at least one electronic chip, at least part of the at least one spacer body, part of the first heat removal body and part of the second heat removal body. 
     
     
         17 . The package according to  claim 11 , wherein at least one of the second interconnection and the third interconnection comprises SnAg. 
     
     
         18 . A vehicle comprising a package according to  claim 1 .