Inventor · disambiguated record
Avgerinos V. Gelatos
Also filed as: GELATOS AVGERINOS · GELATOS AVGERINOS V · GELATOS AVGERINOS V JERRY
71 granted patents·44 pending applications·2,187 citations·filing 1990–2025
99Inventor score
Top patents by PatentIndex Score
115 records- 0197US9685371B2Method of enabling seamless cobalt gap-fillAPPLIED MATERIALS INC·Filed 2014·Granted Jun 20, 2017·35 cites·13 claims
- 0297US6998014B2Apparatus and method for plasma assisted depositionAPPLIED MATERIALS INC·Filed 2002·Granted Feb 14, 2006·167 cites·17 claims
- 0397US5447887AMethod for capping copper in semiconductor devicesMOTOROLA INC·Filed 1994·Granted Sep 5, 1995·312 cites·21 claims
- 0496US9601339B2Methods for depositing fluorine/carbon-free conformal tungstenAPPLIED MATERIALS INC·Filed 2015·Granted Mar 21, 2017·13 cites·18 claims
- 0596US7745333B2Methods for depositing tungsten layers employing atomic layer deposition techniquesAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·47 cites·15 claims
- 0696US7691442B2Ruthenium or cobalt as an underlayer for tungsten film depositionAPPLIED MATERIALS INC·Filed 2008·Granted Apr 6, 2010·39 cites·25 claims
- 0796US7605083B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2008·Granted Oct 20, 2009·39 cites·25 claims
- 0896US7429402B2Ruthenium as an underlayer for tungsten film depositionAPPLIED MATERIALS INC·Filed 2004·Granted Sep 30, 2008·101 cites·28 claims
- 0996US6939804B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·116 cites·61 claims
- 1096US5391517AProcess for forming copper interconnect structureMOTOROLA INC·Filed 1993·Granted Feb 21, 1995·300 cites·15 claims
- 1195US9528183B2Cobalt removal for chamber clean or pre-clean processAPPLIED MATERIALS INC·Filed 2014·Granted Dec 27, 2016·25 cites·11 claims
- 1295US9330939B2Method of enabling seamless cobalt gap-fillZOPE BHUSHAN N·Filed 2013·Granted May 3, 2016·50 cites·18 claims
- 1395US9230815B2Methods for depositing fluorine/carbon-free conformal tungstenAPPLIED MATERIALS INC·Filed 2013·Granted Jan 5, 2016·17 cites·20 claims
- 1495US7514353B2Contact metallization scheme using a barrier layer over a silicide layerAPPLIED MATERIALS INC·Filed 2006·Granted Apr 7, 2009·37 cites·33 claims
- 1595US7175713B2Apparatus for cyclical deposition of thin filmsAPPLIED MATERIALS INC·Filed 2003·Granted Feb 13, 2007·110 cites·11 claims
- 1695US6174810B1Copper interconnect structure and method of formationMOTOROLA INC·Filed 1998·Granted Jan 16, 2001·235 cites·13 claims
- 1794US7732327B2Vapor deposition of tungsten materialsAPPLIED MATERIALS INC·Filed 2008·Granted Jun 8, 2010·58 cites·25 claims
- 1894US6827815B2Showerhead assembly for a processing chamberAPPLIED MATERIALS INC·Filed 2002·Granted Dec 7, 2004·133 cites·20 claims
- 1992US7384867B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·16 cites·48 claims
- 2089US9735009B2Pre-clean of silicon germanium for pre-metal contact at source and drain and pre-high K at channelAPPLIED MATERIALS INC·Filed 2015·Granted Aug 15, 2017·5 cites·12 claims
- 2188US9966275B2Methods of treating nitride filmsAPPLIED MATERIALS INC·Filed 2016·Granted May 8, 2018·6 cites·19 claims
- 2288US7521379B2Deposition and densification process for titanium nitride barrier layersAPPLIED MATERIALS INC·Filed 2007·Granted Apr 21, 2009·11 cites·9 claims
- 2387US10418246B2Remote hydrogen plasma titanium deposition to enhance selectivity and film uniformityAPPLIED MATERIALS INC·Filed 2017·Granted Sep 17, 2019·4 cites·8 claims
- 2487US10043709B2Methods for thermally forming a selective cobalt layerAPPLIED MATERIALS INC·Filed 2015·Granted Aug 7, 2018·5 cites·19 claims
- 2586US8617985B2High temperature tungsten metallization processAPPLIED MATERIALS INC·Filed 2012·Granted Dec 31, 2013·7 cites·19 claims
- 2686US5064683AMethod for polish planarizing a semiconductor substrate by using a boron nitride polish stopMOTOROLA INC·Filed 1990·Granted Nov 12, 1991·103 cites·11 claims
- 2785US12293902B2Process kit for a substrate supportAPPLIED MATERIALS INC·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 2885US9230835B2Integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devicesAPPLIED MATERIALS INC·Filed 2014·Granted Jan 5, 2016·6 cites·20 claims
- 2985US8920564B2Methods and apparatus for thermal based substrate processing with variable temperature capabilityTZU GWO-CHUAN·Filed 2011·Granted Dec 30, 2014·4 cites·12 claims
- 3084US11114320B2Processing system and method of forming a contactAPPLIED MATERIALS INC·Filed 2019·Granted Sep 7, 2021·3 cites·19 claims
- 3184US7779784B2Apparatus and method for plasma assisted depositionAPPLIED MATERIALS INC·Filed 2005·Granted Aug 24, 2010·8 cites·32 claims
- 3283US5324690ASemiconductor device having a ternary boron nitride film and a method for forming the sameMOTOROLA INC·Filed 1993·Granted Jun 28, 1994·82 cites·17 claims
- 3382US9842769B2Method of enabling seamless cobalt gap-fillAPPLIED MATERIALS INC·Filed 2016·Granted Dec 12, 2017·3 cites·20 claims
- 3481US10770300B2Remote hydrogen plasma titanium deposition to enhance selectivity and film uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Sep 8, 2020·2 cites·15 claims
- 3581US10163630B2Pre-clean of silicon germanium for pre-metal contact at source and drain and pre-high k at channelAPPLIED MATERIALS INC·Filed 2017·Granted Dec 25, 2018·2 cites·17 claims
- 3680US11380536B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·1 cites·18 claims
- 3780US10199230B2Methods for selective deposition of metal silicides via atomic layer deposition cyclesAPPLIED MATERIALS INC·Filed 2015·Granted Feb 5, 2019·3 cites·19 claims
- 3880US8835311B2High temperature tungsten metallization processAPPLIED MATERIAL INC·Filed 2013·Granted Sep 16, 2014·4 cites·19 claims
- 3979US7838441B2Deposition and densification process for titanium nitride barrier layersAPPLIED MATERIALS INC·Filed 2009·Granted Nov 23, 2010·5 cites·15 claims
- 4078US12281387B2Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·0 cites·5 claims
- 4178US11387134B2Process kit for a substrate supportAPPLIED MATERIALS INC·Filed 2019·Granted Jul 12, 2022·2 cites·19 claims
- 4278US2025250675A1Method of depositing metal filmsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4376US11887855B2Methods for depositing fluorine/carbon-free conformal tungstenAPPLIED MATERIALS INC·Filed 2021·Granted Jan 30, 2024·0 cites·19 claims
- 4475US9783889B2Apparatus for variable substrate temperature controlTZU GWO-CHUAN·Filed 2012·Granted Oct 10, 2017·1 cites·20 claims
- 4575US5275973AMethod for forming metallization in an integrated circuitMOTOROLA INC·Filed 1993·Granted Jan 4, 1994·53 cites·20 claims
- 4674US12406849B2Methods and apparatus for enhancing selectivity of titanium and titanium silicides during chemical vapor depositionAPPLIED MATERIALS INC·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 4774US8123860B2Apparatus for cyclical depositing of thin filmsTHAKUR RANDHIR P S·Filed 2008·Granted Feb 28, 2012·4 cites·14 claims
- 4872US8513116B2Atomic layer deposition of tungsten materialsKHANDELWAL AMIT·Filed 2012·Granted Aug 20, 2013·2 cites·20 claims
- 4971US8211799B2Atomic layer deposition of tungsten materialsKHANDELWAL AMIT·Filed 2011·Granted Jul 3, 2012·2 cites·22 claims
- 5070US8821637B2Temperature controlled lid assembly for tungsten nitride depositionGELATOS AVGERINOS V·Filed 2008·Granted Sep 2, 2014·3 cites·14 claims
Showing the top 50 of 115 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →