Inventor · disambiguated record
Jessica Weninger
Also filed as: WENINGER JESSICA · WENINGER JESSICA A
2 granted patents·9 pending applications·10 citations·filing 2006–2025
52Inventor score
Files withReynolds Consumer Products LLC5SUH DAEWOONG3INTEL CORP1SUPRIYA LAKSHMI1VASUDEVANPILLAI GANESH V1
Top patents by PatentIndex Score
11 records- 0179US8383459B2Methods of processing a thermal interface materialINTEL CORP·Filed 2008·Granted Feb 26, 2013·10 cites·4 claims
- 0275US2025002208A1Containers, blanks, and methods for dispensing web materialReynolds Consumer Products LLC·Filed 2024·Application pending·0 cites
- 0371US2025250059A1Containers, blanks, and methods for dispensing web materialReynolds Consumer Products LLC·Filed 2025·Application pending·0 cites
- 0471US2025214744A1Containers, blanks, and methods for dispensing web materialReynolds Consumer Products LLC·Filed 2025·Application pending·0 cites
- 0571US2025214745A1Containers, blanks, and methods for dispensing web materialReynolds Consumer Products LLC·Filed 2025·Application pending·0 cites
- 0662US2021292043A1Containers, blanks, and methods for dispensing web materialReynolds Consumer Products LLC·Filed 2021·Application pending·0 cites
- 0747US8592972B2Thermally conductive device with a thermal interface materialSUPRIYA LAKSHMI·Filed 2013·Granted Nov 26, 2013·0 cites·6 claims
- 0843US2008035703A1Oxidation resistant solder preformSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 0938US2009004500A1Multilayer preform for fast transient liquid phase bondingSUH DAEWOONG·Filed 2007·Application pending·0 cites
- 1037US2008233682A1Methods of forming a cored metallic thermal interface material and structures formed therebySUH DAEWOONG·Filed 2007·Application pending·0 cites
- 1134US2007228111A1Microelectronic package and method of forming sameVASUDEVANPILLAI GANESH V·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →