Inventor · disambiguated record
Rajesh Baskaran
Also filed as: BASKARAN RAJESH
13 granted patents·14 pending applications·43 citations·filing 2002–2019
89Inventor score
Top patents by PatentIndex Score
27 records- 0185US7135404B2Method for applying metal features onto barrier layers using electrochemical depositionSEMITOOL INC·Filed 2003·Granted Nov 14, 2006·24 cites·22 claims
- 0284US8961771B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2012·Granted Feb 24, 2015·2 cites·15 claims
- 0384US8236159B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2006·Granted Aug 7, 2012·3 cites·38 claims
- 0483US7628898B2Method and system for idle state operationSEMITOOL INC·Filed 2005·Granted Dec 8, 2009·3 cites·7 claims
- 0576US10855230B2FET operational temperature determination by field plate resistance thermometryMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2019·Granted Dec 1, 2020·2 cites·26 claims
- 0676US10790787B2FET operational temperature determination by gate structure resistance thermometryMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2019·Granted Sep 29, 2020·2 cites·36 claims
- 0775US10147642B1Barrier for preventing eutectic break-through in through-substrate viasMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2013·Granted Dec 4, 2018·3 cites·20 claims
- 0868US2014209472A1Electrolytic process using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 0967US9234293B2Electrolytic copper process using anion permeable barrierAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·1 cites·12 claims
- 1065US8928133B2Interlocking type solder connections for alignment and bonding of wafers and/or substratesBASKARAN RAJESH·Filed 2012·Granted Jan 6, 2015·2 cites·20 claims
- 1161US8123926B2Electrolytic copper process using anion permeable barrierBASKARAN RAJESH·Filed 2006·Granted Feb 28, 2012·1 cites·48 claims
- 1256US11676860B2Barrier for preventing eutectic break-through in through-substrate viasMACOM TECH SOLUTIONS HOLDINGS INC·Filed 2018·Granted Jun 13, 2023·0 cites·20 claims
- 1352US2007261964A1Reactors, systems, and methods for electroplating microfeature workpiecesSEMITOOL INC·Filed 2006·Application pending·0 cites
- 1452US2008264774A1Method for electrochemically depositing metal onto a microelectronic workpieceSEMITOOL INC·Filed 2007·Application pending·0 cites
- 1551US2006079085A1Method for applying metal features onto metallized layers using electrochemical depositionSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1651US2006079083A1Method for applying metal features onto metallized layers using electrochemical deposition using acid treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1751US2006079084A1Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1851US2006084264A1Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatmentSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1950US2006163072A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 2050US2008011450A1Apparatus and Method for Thermally Controlled Processing of Microelectronic WorkpiecesSEMITOOL INC·Filed 2007·Application pending·0 cites
- 2148US8852417B2Electrolytic process using anion permeable barrierBASKARAN RAJESH·Filed 2012·Granted Oct 7, 2014·0 cites·25 claims
- 2248US2006157355A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 2343US2006226019A1Die-level wafer contact for direct-on-barrier platingSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2443US2014246324A1Methods for electrochemical deposition of multi-component solder using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2542US2006260946A1Copper electrolytic process using cation permeable barrierSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2642US2006189129A1Method for applying metal features onto barrier layers using ion permeable barriersSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2740US7252714B2Apparatus and method for thermally controlled processing of microelectronic workpiecesSEMITOOL INC·Filed 2002·Granted Aug 7, 2007·0 cites·64 claims
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