US2006157355A1PendingUtilityA1

Electrolytic process using anion permeable barrier

Assignee: SEMITOOL INCPriority: Mar 21, 2000Filed: Dec 8, 2005Published: Jul 20, 2006
Est. expiryMar 21, 2020(expired)· nominal 20-yr term from priority
H10P 14/47H10W 20/043H10W 20/041H10W 20/035H10W 20/033C25F 3/02C25D 5/022C25D 17/001H05K 3/423C25F 7/00C25D 17/002C25D 3/02C25D 3/38C25D 7/123
48
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

Claims

exact text as granted — not AI-modified
1 . A process for electrolytically processing a microfeature workpiece as the working electrode with a first processing fluid and a counter electrode comprising: 
 contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid comprising first processing fluid species including a cation, an anion, and a complexing agent;    contacting the counter electrode with a second processing fluid;    producing an electrochemical reaction at the counter electrode; and    substantially preventing movement of cationic species between the first processing fluid and the second processing fluid species.    
   
   
       2 . The process of  claim 1 , wherein the step of substantially preventing movement of cationic species between the first processing fluid and the second processing fluid comprises providing an anion permeable barrier between the first processing fluid and the second processing fluid.  
   
   
       3 . The process of  claim 2 , wherein the anion permeable barrier is an anion exchange membrane.  
   
   
       4 . The process of  claim 1 , wherein the working electrode is a cathode, and the counter electrode is an anode.  
   
   
       5 . The process of  claim 4 , wherein the cation of the first processing fluid is a metal ion, and further comprising the step of electrolytically depositing the metal ion onto the surface of the microfeature workpiece.  
   
   
       6 . The process of  claim 5 , wherein the first processing fluid further includes a counter anion of the metal ion and the process further comprises the step of passing the counter anion from the first processing fluid to the second processing fluid through the anion exchange membrane.  
   
   
       7 . The process of  claim 4 , wherein the anode is an inert anode.  
   
   
       8 . The process of  claim 4 , wherein the anode is a consumable anode.  
   
   
       9 . The process of  claim 3 , further comprising the step of passing the anion between the first processing fluid and the second processing fluid through the anion exchange membrane.  
   
   
       10 . The process of  claim 1 , wherein the first processing fluid has a pH greater than 7.0.  
   
   
       11 . The process of  claim 5 , wherein the metal ion is a cation of a metal salt.  
   
   
       12 . The process of  claim 1 , further comprising the step of adding a metal ion to the first processing fluid.  
   
   
       13 . The process of  claim 12 , wherein the metal ion is added to the first processing fluid by adding a metal salt to the first processing fluid.  
   
   
       14 . The process of  claim 1 , wherein the first processing fluid species further include a pH adjustment agent and a buffer.  
   
   
       15 . The process of  claim 14 , further comprising the step of adding a pH adjustment agent to the second processing fluid.  
   
   
       16 . The process of  claim 14 , wherein the second processing fluid comprises a pH adjustment agent and a buffer.  
   
   
       17 . The process of  claim 16 , wherein buffer concentration in the first processing fluid is equal to or less than buffer concentration in the second processing fluid.  
   
   
       18 . The process of  claim 1 , wherein the concentration of the anion in the first processing fluid is greater than the concentration of the anion in the second processing fluid.  
   
   
       19 . The process of  claim 1 , wherein the complexing agent is selected from the group consisting of ethylene diamine, ethylene diamine tetraacetic acid and its salts, cyclam, porphrin, bipyridyl, pyrolle, thiophene, and polyamines.  
   
   
       20 . The process of  claim 1 , wherein the complexing agent is selected from compounds that contain a nitrogen-containing chelating group R—NR 2 —R 1 , where R is any alkyl or aromatic group and R 1  and R 2  are H, alkyl or aryl organic groups or polymer chains.  
   
   
       21 . The process of  claim 1 , wherein the complexing agent includes chemical compounds having at least one part with the chemical structure COOR 1 —COHR 2 R 3  where R 1  is an organic group covalently bound to the carboxylate group (COO), R 2  is either hydrogen or an organic group, and R 3  is either hydrogen or an organic group.  
   
   
       22 . The process of  claim 21 , wherein the complexing agent is selected from the group consisting of citric acid and salts thereof, tartaric acid and salts thereof, diethyltartrate, diisopropyltartrate, and dimethyltartrate.  
   
   
       23 . The process of  claim 1 , wherein pH of the first processing fluid is substantially equal to pH of the second processing fluid.  
   
   
       24 . The process of  claim 1 , further comprising the step of depositing the cation onto the surface of the microelectronic workpiece.  
   
   
       25 . The process of  claim 24 , wherein the surface onto which the cation is deposited comprises a seed material.  
   
   
       26 . The process of  claim 24 , wherein the surface onto which the cation is deposited comprises a barrier material.  
   
   
       27 . The process of  claim 1 , wherein the cation is selected from the group consisting of copper ion, gold ion, tin ion, silver ion, platinum ion, ruthenium ion, rhodium ion, iridium ion, osmium ion, rhenium ion, palladium ion, and nickel ion.  
   
   
       28 . A process for electrolytically processing a microfeature workpiece with a first processing fluid and an inert anode comprising: 
 contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid including a metal ion to be deposited onto the surface of the microfeature workpiece, a counter anion to the metal ion, and a complexing agent;    contacting the inert anode with a second processing fluid, an anion permeable barrier located between the first processing fluid and the second processing fluid;    producing an oxidizing agent at the inert anode;    adding a metal ion to the first processing fluid;    passing the counter anion from first processing fluid to the second processing fluid through the anion permeable barrier; and    depositing the metal ion onto the surface of the microelectronic workpiece.    
   
   
       29 . A process for electrolytically processing a microfeature workpiece with a first processing fluid and an inert anode comprising: 
 contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid comprising first processing fluid species including a metal ion to be deposited onto the surface of the microelectronic workpiece; and    contacting the inert anode with a second processing fluid that includes a buffer and a pH adjustment agent, an ion permeable barrier located between the first processing fluid and the second processing fluid.    
   
   
       30 . The process of  claim 29  wherein the buffer is boric acid.  
   
   
       31 . The process of  claim 29  wherein the pH adjustment agent is tetramethylammonium hydroxide.  
   
   
       32 . A system for electrolytically processing a microfeature workpiece with a first processing fluid comprising: 
 a chamber including: 
 a processing unit for receiving the first processing fluid;  
 a counter electrode unit for receiving a second processing fluid;  
 an counter electrode in the counter electrode unit;  
 an anion permeable barrier between the processing unit and the counter electrode unit;  
   a source of complexing agent;    a source of a metal ion in fluid communication with the processing unit; and    a source of a pH adjustment agent in fluid communication with the counter electrode unit.    
   
   
       33 . The process of  claim 1 , wherein the counter electrode comprises multiple electrodes.  
   
   
       34 . The process of  claim 1 , wherein the working electrode comprises multiple electrodes.  
   
   
       35 . The process of  claim 1 , wherein the working electrode is an anode, and the counter electrode is a cathode.  
   
   
       36 . The process of  claim 35 , wherein the first processing fluid comprises a cation and an anion, and further comprising electrolytic dissolution of metal on the surface of the microfeature workpiece.  
   
   
       37 . The process of  claim 35 , wherein the cathode is an inert electrode in contact with the second processing fluid.  
   
   
       38 . The process of  claim 37 , wherein the second processing fluid includes an anion and a cation.  
   
   
       39 . The process of  claim 38 , wherein reduction of chemical species in the second processing fluid occurs at the cathode.  
   
   
       40 . The process of  claim 39 , wherein the non-anionic chemical species in the first processing fluid are separated from the inert cathode by an anion permeable barrier.  
   
   
       41 . The process of  claim 35 , wherein the second processing fluid further includes a counter anion of a metal present on the surface of the microfeature workpiece and the process further comprises passing the counter anion from the second processing fluid to the first processing fluid through an anion permeable barrier.  
   
   
       42 . The process of  claim 35 , wherein the first processing fluid has a pH less than 7.0.  
   
   
       43 . The process of  claim 35 , wherein the cation is a metal ion of a metal salt.  
   
   
       44 . The process of  claim 35 , further comprising the step of adding an anion to the second processing fluid.  
   
   
       45 . The process of  claim 44 , wherein the anion is added to the second processing fluid by adding an acid to the second processing fluid.  
   
   
       46 . The process of  claim 35 , wherein the first processing fluid species further include a pH adjustment agent and a buffer.  
   
   
       47 . The process of  claim 46 , further comprising the step of adding a pH adjustment agent to the second processing fluid.  
   
   
       48 . The process of  claim 46 , wherein the second processing fluid comprises a pH adjustment agent and a buffer.  
   
   
       49 . The process of  claim 48 , wherein buffer concentration in the first processing fluid is equal to or greater than buffer concentration in the second processing fluid.  
   
   
       50 . The process of  claim 1 , wherein the cation is a metal ion of a metal salt and the anion is a counter ion of the metal salt, the second processing fluid comprising the anion, concentration of the anion in the second processing fluid being greater than concentration of the anion in the first processing fluid.  
   
   
       51 . The process of  claim 1 , further comprising the step of electrolytically dissolving metal from the surface of the microfeature workpiece.  
   
   
       52 . A process for electrolytically processing a microfeature workpiece with a first processing fluid and cathode comprising: 
 contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid including an anion;    contacting the cathode with a second processing fluid containing the anion, an anion permeable barrier located between the first processing fluid and the second processing fluid;    reducing chemical species in the second processing fluid;    adding acid to the second processing fluid;    passing the anion from the second processing fluid to the first processing fluid through the anion permeable barrier; and    electrolytically dissolving metal from the surface of the microfeature workpiece.    
   
   
       53 . A system for electrolytically processing a microfeature workpiece with a first processing fluid comprising: 
 a chamber including: 
 a processing unit for receiving the first processing fluid;  
 a counter electrode unit for receiving a second processing fluid;  
 a cathode in the counter electrode unit;  
 an anion permeable barrier between the processing unit and the counter electrode unit;  
   a source of metal counter ion in fluid communication with the counter electrode unit; and    a source of a pH adjustment agent in fluid communication with the processing unit.

Join the waitlist — get patent alerts

Track US2006157355A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.