Inventor · disambiguated record
Robert W. Batz, Jr.
Also filed as: BATZ JR ROBERT W · BATZ ROBERT W · BATZ ROBERT W JR
22 granted patents·10 pending applications·292 citations·filing 1997–2014
95Inventor score
Top patents by PatentIndex Score
32 records- 0193US6334937B1Apparatus for high deposition rate solder electroplating on a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Jan 1, 2002·104 cites·18 claims
- 0284US8961771B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2012·Granted Feb 24, 2015·2 cites·15 claims
- 0384US8236159B2Electrolytic process using cation permeable barrierBASKARAN RAJESH·Filed 2006·Granted Aug 7, 2012·3 cites·38 claims
- 0484US6527925B1Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2000·Granted Mar 4, 2003·23 cites·32 claims
- 0582US6806186B2Submicron metallization using electrochemical depositionSEMITOOL INC·Filed 2001·Granted Oct 19, 2004·21 cites·22 claims
- 0681US6911127B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Jun 28, 2005·17 cites·42 claims
- 0778US6527926B2Electroplating reactor including back-side electrical contact apparatusSEMITOOL INC·Filed 2001·Granted Mar 4, 2003·19 cites·10 claims
- 0876US10260855B2Electroplating tool with feedback of metal thickness distribution and correctionAPPLIED MATERIALS INC·Filed 2013·Granted Apr 16, 2019·2 cites·9 claims
- 0969US6001234AMethods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1997·Granted Dec 14, 1999·30 cites·2 claims
- 1068US2014209472A1Electrolytic process using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1167US9234293B2Electrolytic copper process using anion permeable barrierAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·1 cites·12 claims
- 1267US7144805B2Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current densitySEMITOOL INC·Filed 2004·Granted Dec 5, 2006·8 cites·29 claims
- 1361US8123926B2Electrolytic copper process using anion permeable barrierBASKARAN RAJESH·Filed 2006·Granted Feb 28, 2012·1 cites·48 claims
- 1461US6090711AMethods for controlling semiconductor workpiece surface exposure to processing liquidsSEMITOOL INC·Filed 1997·Granted Jul 18, 2000·29 cites·23 claims
- 1560US6939448B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted Sep 6, 2005·6 cites·29 claims
- 1658US7048841B2Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpiecesSEMITOOL INC·Filed 2003·Granted May 23, 2006·5 cites·5 claims
- 1758US6669834B2Method for high deposition rate solder electroplating on a microelectronic workpieceSEMITOOL INC·Filed 2001·Granted Dec 30, 2003·2 cites·52 claims
- 1850US2006163072A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 1950US2008011450A1Apparatus and Method for Thermally Controlled Processing of Microelectronic WorkpiecesSEMITOOL INC·Filed 2007·Application pending·0 cites
- 2048US8852417B2Electrolytic process using anion permeable barrierBASKARAN RAJESH·Filed 2012·Granted Oct 7, 2014·0 cites·25 claims
- 2148US6461494B1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootSEMITOOL INC·Filed 1999·Granted Oct 8, 2002·11 cites·5 claims
- 2248US2006157355A1Electrolytic process using anion permeable barrierSEMITOOL INC·Filed 2005·Application pending·0 cites
- 2346US6849167B2Electroplating reactor including back-side electrical contact apparatusSEMITOOL INC·Filed 2003·Granted Feb 1, 2005·1 cites·12 claims
- 2443US2014246324A1Methods for electrochemical deposition of multi-component solder using cation permeable barrierAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2542US2006260946A1Copper electrolytic process using cation permeable barrierSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2642US2006189129A1Method for applying metal features onto barrier layers using ion permeable barriersSEMITOOL INC·Filed 2006·Application pending·0 cites
- 2741US2004035707A1Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing bootFiled 2003·Application pending·0 cites
- 2840US7252714B2Apparatus and method for thermally controlled processing of microelectronic workpiecesSEMITOOL INC·Filed 2002·Granted Aug 7, 2007·0 cites·64 claims
- 2940US2003045095A1Method for filling recessed micro-structures with metallization in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Application pending·0 cites
- 3038US2005205111A1Method and apparatus for processing a microfeature workpiece with multiple fluid streamsRITZDORF THOMAS L·Filed 2004·Application pending·0 cites
- 3133US6805778B1Contact assembly for supplying power to workpieces during electrochemical processingSEMITOOL INC·Filed 1999·Granted Oct 19, 2004·4 cites·3 claims
- 3230US6602383B1Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic componentsSEMITOOL INC·Filed 1999·Granted Aug 5, 2003·3 cites·14 claims
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