Inventor · disambiguated record
Fumio Kuriyama
Also filed as: KURIYAMA FUMIO
24 granted patents·12 pending applications·718 citations·filing 1989–2014
96Inventor score
Top patents by PatentIndex Score
36 records- 0197US5951923AVaporizer apparatus and film deposition apparatus therewithEBARA CORP·Filed 1997·Granted Sep 14, 1999·275 cites·45 claims
- 0290US6294059B1Substrate plating apparatusEBARA CORP·Filed 1998·Granted Sep 25, 2001·83 cites·72 claims
- 0387US8252167B2Plating apparatusKURIYAMA FUMIO·Filed 2010·Granted Aug 28, 2012·4 cites·14 claims
- 0487US7507319B2Anode holderEBARA CORP·Filed 2006·Granted Mar 24, 2009·5 cites·16 claims
- 0587US7012333B2Lead free bump and method of forming the sameEBARA CORP·Filed 2003·Granted Mar 14, 2006·36 cites·5 claims
- 0687US6195504B1Liquid feed vaporization system and gas injection deviceEBARA CORP·Filed 1997·Granted Feb 27, 2001·58 cites·13 claims
- 0785US6379520B1Plating apparatusEBARA CORP·Filed 1999·Granted Apr 30, 2002·40 cites·58 claims
- 0884US4926648ATurbomolecular pump and method of operating the sameTOSHIBA CORP·Filed 1989·Granted May 22, 1990·40 cites·11 claims
- 0983US6544585B1Method and apparatus for plating a substrateEBARA CORP·Filed 1998·Granted Apr 8, 2003·65 cites·33 claims
- 1081US6269221B1Liquid feed vaporization system and gas injection deviceEBARA CORP·Filed 2000·Granted Jul 31, 2001·16 cites·18 claims
- 1181US5062271AEvacuation apparatus and evacuation methodTOSHIBA KK·Filed 1990·Granted Nov 5, 1991·45 cites·8 claims
- 1279US8048282B2Apparatus and method for plating a substrateEBARA CORP·Filed 2008·Granted Nov 1, 2011·2 cites·11 claims
- 1374US7875158B2Plating apparatusEBARA CORP·Filed 2004·Granted Jan 25, 2011·7 cites·14 claims
- 1473US8317993B2Plating method and apparatusKURIYAMA FUMIO·Filed 2009·Granted Nov 27, 2012·4 cites·11 claims
- 1569US9376758B2Electroplating methodYASUDA SHINGO·Filed 2011·Granted Jun 28, 2016·1 cites·8 claims
- 1668US2009301395A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2009·Application pending·0 cites
- 1767US2009218231A1Plating apparatusYAJIMA TOSHIKAZU·Filed 2009·Application pending·0 cites
- 1860US2013015075A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2012·Application pending·0 cites
- 1958USD572673SAnode shaftEBARA CORP·Filed 2006·Granted Jul 8, 2008·10 cites·1 claims
- 2057US8784636B2Plating apparatus and plating methodNAGAI MIZUKI·Filed 2008·Granted Jul 22, 2014·1 cites·15 claims
- 2155US8877030B2Plating apparatus and plating method for forming magnetic filmENDO YASUHIKO·Filed 2009·Granted Nov 4, 2014·0 cites·20 claims
- 2253US2014287580A1Method for forming conductive structure, and plating apparatus and plating methodEBARA CORP·Filed 2014·Application pending·0 cites
- 2352US6929722B2Substrate plating apparatusEBARA CORP·Filed 2001·Granted Aug 16, 2005·2 cites·49 claims
- 2449US2006141157A1Plating apparatus and plating methodSEKIMOTO MASAHIKO·Filed 2004·Application pending·0 cites
- 2548US2004262150A1Plating deviceFiled 2003·Application pending·0 cites
- 2647US2004245112A1Apparatus and method for plating a substrateFiled 2004·Application pending·0 cites
- 2746US2005279640A1Method of forming a lead-free bump and a plating apparatus thereforSHIMOYAMA MASASHI·Filed 2005·Application pending·0 cites
- 2844US9297088B2Electroplating method and electroplating apparatus for through-holeEBARA CORP·Filed 2013·Granted Mar 29, 2016·0 cites·11 claims
- 2944USD583779SElectrolytic plating anodeEBARA CORP·Filed 2006·Granted Dec 30, 2008·5 cites·1 claims
- 3043US6495004B1Substrate plating apparatusEBARA CORP·Filed 1999·Granted Dec 17, 2002·9 cites·16 claims
- 3143US2004163947A1Substrate plating apparatusFiled 2004·Application pending·0 cites
- 3241US2007117365A1Plating method and apparatusEBARA CORP·Filed 2004·Application pending·0 cites
- 3337USRE39123EPlating apparatusEBARA CORP·Filed 1999·Granted Jun 13, 2006·3 cites·82 claims
- 3437US2006081478A1Plating apparatus and plating methodSAHODA TSUYOSHI·Filed 2005·Application pending·0 cites
- 3536USRE36610EEvacuation apparatus and evacuation methodTOSHIBA KK·Filed 1997·Granted Mar 14, 2000·7 cites·10 claims
- 3630US2011180412A1Plating method and plating apparatusSHIMOYAMA MASASHI·Filed 2011·Application pending·0 cites
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