Apparatus and method for plating a substrate

Abstract

The present invention is directed to a plating apparatus and method in which bubbles generated at the plating surfaces are easily removed and the uniformity of the thickness of the plated film within the plated surface can be improved. The plating apparatus comprises a cassette table for loading a cassette in which a substrate having a plating surface is contained. An aligner for aligning the substrate, a rinser-dryer for rinsing and drying the substrate, and a plating unit for plating the substrate are also provided. The plating unit comprises a plating vessel containing a plating solution, a holder for holding the substrate to immerse the substrate in the plating solution in the plating vessel. The plating surface is exposed to a nozzle which ejects the plating solution toward the plating surface.

1 . An apparatus for plating a substrate, said substrate having a plating surface to be plated, said apparatus comprising: 
 a cassette table for loading a cassette containing therein a substrate;    an aligner for aligning said substrate;    a rinser-dryer for rinsing and drying said substrate; and    a plating unit for plating said substrate, said plating unit comprising a plating vessel containing a plating solution, a holder for holding said substrate while being immersed in said plating solution in said plating vessel so as to expose said plating surface to said plating solution, and a nozzle for ejecting said plating solution toward said plating surface.    
     
     
         2 . The apparatus of  claim 1 , wherein said nozzle is movable parallel to said plating surface.  
     
     
         3 . The apparatus of  claim 1 , wherein said nozzle is provided between an anode, which is placed within said plating vessel to confront said plating surface, and said plating surface.  
     
     
         4 . The apparatus of  claim 1 , wherein said nozzle is provided on a puddle movably arranged within said plating vessel for agitating said plating solution within said plating vessel.  
     
     
         5 . The apparatus of  claim 1 , wherein said nozzle is provided on a regulation plate arranged between an anode placed in said plating vessel and said plating surface.  
     
     
         6 . The apparatus of  claim 1 , wherein an ejecting angle of said nozzle relative to said plating surface is adjustable.  
     
     
         7 . The apparatus of  claim 1 , wherein said nozzle is supplied with a plating solution within said plating vessel circulated by a circulation line.  
     
     
         8 . The apparatus of  claim 1 , wherein said nozzle is provided with a flow controller for controlling a flow rate of said plating solution ejected by said nozzle.  
     
     
         9 . The apparatus of  claim 1 , wherein said nozzle comprises a nozzle assembly comprising a plurality of nozzles.  
     
     
         10 . A method of plating a substrate having a plating surface to be plated, said method comprising: 
 holding said substrate with a substrate holder;    immersing said holder in a plating solution contained in a plating vessel so as to expose said plating surface to said plating solution;    placing a nozzle in said plating vessel to confront to said plating surface;    ejecting a plating solution from said nozzle toward said plating surface.    
     
     
         11 . The method of  claim 10 , wherein aid nozzle is moved while ejecting said plating solution.  
     
     
         12 . An apparatus for plating a substrate having a plating surface to be plated, said apparatus comprising: 
 a plating vessel containing a plating solution;    a holder for holding said substrate while exposing said plating surface to said plating solution within said plating vessel;    a nozzle provided in said plating vessel for ejecting a plating solution toward said plating surface.    
     
     
         13 . The apparatus of  claim 12 , wherein said nozzle is movable relative to said plating surface.  
     
     
         14 . The apparatus of  claim 12 , wherein said nozzle is arranged to eject said plating solution at a substantially right angle relative to said plating surface.  
     
     
         15 . The apparatus of  claim 12 , wherein said nozzle is arranged to eject said plating solution at an oblique angle relative to said plating surface.  
     
     
         16 . An apparatus for plating a substrate having a plating surface to be plated, said apparatus comprising: 
 a plating vessel accommodating a plating solution and an anode therein and having a lateral opening;    a substrate holder for holding said substrate while exposing said plating surface to said plating solution within said plating vessel and sealing said substrate to prevent infiltration of plating solution to a surface of said substrate other than said exposed plating surface; and    holder driving assembly for driving said substrate holder to a position where said plating surface covers said opening of said plating vessel.    
     
     
         17 . The apparatus of  claim 16 , wherein said substrate holder is laterally slidable.  
     
     
         18 . The apparatus of  claim 16 , wherein said plating vessel comprises a weir member for confining a reservoir surrounding said anode within said plating vessel, which can contain plating solution therein for immersing said anode.  
     
     
         19 . The apparatus of  claim 18 , further comprising an auxiliary plating solution supply system for circulating said plating solution within said reservoir chamber.  
     
     
         20 . The apparatus of  claim 16 , further comprising a rapid drain system for rapidly draining plating solution from said plating vessel.  
     
     
         21 . The apparatus of  claim 16 , further comprising a nozzle for ejecting plating solution toward said plating surface of said substrate held by said substrate holder.  
     
     
         22 . The apparatus of  claim 16 , wherein said substrate holder comprises a detachable seal unit comprising a seal ring and a cathode integrated together.  
     
     
         23 . The apparatus of  claim 22 , wherein said seal unit comprises a seal member for water-tightly sealing said opening of said plating vessel.  
     
     
         24 . A method of plating a substrate having a plating surface to be plated, said method comprising: 
 accommodating a plating solution and an anode in a plating vessel having a lateral opening;    holding said substrate with a substrate holder while exposing said plating surface to said plating solution within said plating vessel and sealing said substrate to prevent infiltration of plating solution to a surface of said substrate other than said exposed plating surface; and    driving said substrate holder to a position where said plating surface covers said opening of said plating vessel.    
     
     
         25 . The method of  claim 24 , wherein said plating vessel comprises a weir member for confining a reservoir surrounding said anode within said plating vessel, said method comprising immersing said anode by introducing plating solution within said reservoir.  
     
     
         26 . The method of  claim 24 , further comprising rapidly draining plating solution from said plating vessel after plating is finished.