Substrate plating apparatus

Abstract

A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.

What is claimed is:  
     
         1 . A substrate plating apparatus for plating a substrate, comprising: 
 a plating unit including at least one plating chamber for containing a plating solution for plating a metal layer onto a semiconductor substrate;    a concentration analyzing device to analyze concentrations of the plating solution, wherein said concentration analyzing device includes a metal ion concentration analyzer and a plating additive concentration analyzer; and    a plating solution preparing unit for preparing the plating solution based on results from said concentration analyzing device.