Plating device

Abstract

A plating apparatus according to the present invention has a plating tank ( 40 ) for holding a plating solution ( 10 ), an anode ( 56 ) disposed so as to be immersed in the plating solution ( 10 ) in the plating tank ( 40 ), a regulation plate ( 60 ) disposed between the anode ( 56 ) and a plating workpiece (W) disposed so as to face the anode ( 56 ), and a plating power supply ( 24 ) for supply a current between the anode ( 56 ) and the plating workpiece (W) to carry out plating. The regulation plate ( 60 ) is disposed so as to separate the plating solution ( 10 ) held in the plating tank ( 40 ) into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group ( 68 ) having a large number of through-holes ( 66 ) is formed in the regulation plate ( 60 ).

1 . A plating apparatus characterized by comprising: 
 a plating tank for holding a plating solution;    an anode disposed so as to be immersed in the plating solution in said plating tank;    a regulation plate disposed between said anode and a plating workpiece disposed so as to face said anode; and    a plating power supply for supply a current between said anode and the plating workpiece to carry out plating,    wherein said regulation plate is disposed so as to separate the plating solution held in said plating tank into a plating solution on said anode side and a plating solution on the plating workpiece side, and a through-hole group having a large number of through-holes is formed in said regulation plate.    
     
     
         2 . The plating apparatus according to  claim 1 , characterized in that said through-hole group is formed by a plurality of slit-like elongated holes extending linearly in one direction or extending in an arc.  
     
     
         3 . The plating apparatus according to  claim 1 , characterized in that said through-hole group is formed by a plurality of cross holes extending crosswise in vertical and horizontal directions.  
     
     
         4 . The plating apparatus according to  claim 1 , characterized in that said through-hole group is formed by a combination of a plurality of fine holes, a plurality of holes having different diameters, and slit-like elongated holes.  
     
     
         5 . The plating apparatus according to  claim 1 , characterized in that said through-hole group is formed in said regulation plate substantially over an entire area facing the plating workpiece, and formed in an area substantially similar to a shape of the plating workpiece.  
     
     
         6 . The plating apparatus according to  claim 1 , characterized by comprising an agitating mechanism provided between the plating workpiece and said regulation plate for agitating the plating solution held in said plating tank.  
     
     
         7 . The plating apparatus according to  claim 6 , characterized in that said agitating mechanism comprises a paddle-type agitating mechanism having a paddle which reciprocates parallel to the plating workpiece.  
     
     
         8 . The plating apparatus according to  claim 1 , characterized in that said anode and said regulation plate are provided in a vertical direction.  
     
     
         9 . A plating apparatus characterized by comprising: 
 a plating tank for holding a plating solution;    an anode disposed so as to be immersed in the plating solution in said plating tank;    a regulation plate disposed between said anode and a plating workpiece disposed so as to face said anode; and    a plating power supply for supply a current between said anode and the plating workpiece to carry out plating,    wherein said regulation plate is disposed so as to separate the plating solution held in said plating tank into a plating solution on said anode side and a plating solution on the plating workpiece side, and a plating solution passage is formed in said regulation plate for allowing an electric field to uniformly pass therethrough and allowing the plating solution to pass therethrough.    
     
     
         10 . The plating apparatus according to  claim 9 , characterized in that a length of said plating solution passage is set to be in a range of 10 to 90 mm.  
     
     
         11 . The plating apparatus according to  claim 9 , characterized in that said plating solution passage is defined by an inner circumferential surface of a cylindrical member or a rectangular block.  
     
     
         12 . The plating apparatus according to  claim 11 , characterized in that a large number of through-holes having a size such as to prevent leakage of an electric field are formed in a circumferential wall of said cylindrical member.  
     
     
         13 . The plating apparatus according to  claim 9 , characterized by comprising an agitating mechanism provided in at least one of a space between the plating workpiece and said regulation plate and a space between said anode and said regulation plate for agitating the plating solution held in said plating tank.  
     
     
         14 . The plating apparatus according to  claim 13 , characterized in that said agitating mechanism comprises a paddle-type agitating mechanism having a paddle which reciprocates parallel to the plating workpiece.  
     
     
         15 . The plating apparatus according to  claim 13 , characterized in that said agitating mechanism comprises a plating solution injection type agitating mechanism having a plurality of plating solution injection nozzles for injecting the plating solution toward the plating workpiece.  
     
     
         16 . The plating apparatus according to  claim 13 , characterized in that said plating solution passage is formed in said regulation plate integrally with said regulation plate.  
     
     
         17 . A plating apparatus characterized by comprising: 
 a plating tank for holding a plating solution;    an anode disposed so as to be immersed in the plating solution in said plating tank;    a regulation plate disposed between said anode and a plating workpiece disposed so as to face said anode for separating the plating solution held in said plating tank into a plating solution on said anode side and a plating solution on the plating workpiece side, said regulation plate having a plating solution passage for allowing an electric field to uniformly pass therethrough and allowing the plating solution to pass therethrough;    a plating power supply for supply a current between said anode and the plating workpiece to carry out plating; and    an electric field adjustment ring disposed at an end of said plating solution passage on the plating workpiece side for adjusting an electric field at a peripheral portion of the plating workpiece.    
     
     
         18 . The plating apparatus according to  claim 17 , characterized in that a width of said electric field adjustment ring is set to be in a range of 1 to 20 mm.  
     
     
         19 . The plating apparatus according to  claim 17 , characterized in that a gap between said electric field adjustment ring and the plating workpiece is set to be in a range of 0.5 to 30 mm.  
     
     
         20 . The plating apparatus according to  claim 17 , characterized in that said plating solution passage is defined by an inner circumferential surface of a cylindrical member, and said electric field adjustment ring is connected to an end of said cylindrical member on the plating workpiece side.  
     
     
         21 . The plating apparatus according to  claim 20 , characterized in that a large number of through-holes having a size such as to prevent leakage of an electric field are formed in a circumferential wall of said cylindrical member.  
     
     
         22 . The plating apparatus according to  claim 17 , characterized in that said plating solution passage is defined by an inner circumferential surface of a cylindrical member, and said electric field adjustment ring is disposed at an end of said cylindrical member on the plating workpiece side so as to be separated from said cylindrical member.  
     
     
         23 . The plating apparatus according to  claim 17 , characterized in that said plating solution passage is defined by an inner circumferential surface of a cylindrical member, and said electric field adjustment ring is formed on an end surface of the plating workpiece side.  
     
     
         24 . The plating apparatus according to  claim 17 , characterized by comprising an agitating mechanism provided in at least one of a space between the plating workpiece and said regulation plate and a space between said anode and said regulation plate for agitating the plating solution held in said plating tank.  
     
     
         25 . The plating apparatus according to  claim 24 , characterized in that said agitating mechanism comprises a paddle-type agitating mechanism having a paddle which reciprocates parallel to the plating workpiece.  
     
     
         26 . The plating apparatus according to  claim 24 , characterized in that said agitating mechanism comprises a plating solution injection type agitating mechanism having a plurality of plating solution injection nozzles for injecting the plating solution toward the plating workpiece.