Inventor · disambiguated record
Gerhard Schneider
Also filed as: SCHNEIDER GERHARD · SCHNEIDER GERHARD M
13 granted patents·3 pending applications·2,418 citations·filing 1996–2007
95Inventor score
Top patents by PatentIndex Score
16 records- 0199US6917755B2Substrate supportAPPLIED MATERIALS INC·Filed 2003·Granted Jul 12, 2005·493 cites·92 claims
- 0297US6308654B1Inductively coupled parallel-plate plasma reactor with a conical domeAPPLIED MATERIALS INC·Filed 1996·Granted Oct 30, 2001·206 cites·31 claims
- 0396US6364957B1Support assembly with thermal expansion compensationAPPLIED MATERIALS INC·Filed 2000·Granted Apr 2, 2002·368 cites·55 claims
- 0496US6261408B1Method and apparatus for semiconductor processing chamber pressure controlAPPLIED MATERIALS INC·Filed 2000·Granted Jul 17, 2001·147 cites·21 claims
- 0596US6095083AVacuum processing chamber having multi-mode accessAPPLIED MATERIELS INC·Filed 1997·Granted Aug 1, 2000·534 cites·42 claims
- 0696US6074512AInductively coupled RF plasma reactor having an overhead solenoidal antenna and modular confinement magnet linersAPPLIED MATERIALS INC·Filed 1997·Granted Jun 13, 2000·236 cites·101 claims
- 0795US6962644B2Tandem etch chamber plasma processing systemAPPLIED MATERIALS INC·Filed 2002·Granted Nov 8, 2005·108 cites·35 claims
- 0894US6263829B1Process chamber having improved gas distributor and method of manufactureAPPLIED MATERIALS INC·Filed 1999·Granted Jul 24, 2001·127 cites·55 claims
- 0989US6454898B1Inductively coupled RF Plasma reactor having an overhead solenoidal antenna and modular confinement magnet linersAPPLIED MATERIALS INC·Filed 2000·Granted Sep 24, 2002·43 cites·28 claims
- 1085US6151203AConnectors for an electrostatic chuck and combination thereofAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·76 cites·20 claims
- 1184US7552736B2Process for wafer backside polymer removal with a ring of plasma under the waferAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·9 cites·10 claims
- 1283US6056267AIsolation valve with extended seal lifeAPPLIED MATERIALS INC·Filed 1998·Granted May 2, 2000·41 cites·28 claims
- 1366US6220607B1Thermally conductive conformal mediaAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·30 cites·25 claims
- 1444US2008179287A1Process for wafer backside polymer removal with wafer front side gas purgeCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 1544US2008179288A1Process for wafer backside polymer removal and wafer front side scavenger plasmaCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 1636US2002148565A1Mushroom stem wafer pedestal for improved conductance and uniformityAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →