Inventor · disambiguated record
Sung Keun Park
Also filed as: PARK SUNG · PARK SUNG K · PARK SUNG KEUN · PARK SUNG P
19 granted patents·35 pending applications·21 citations·filing 2004–2024
90Inventor score
Top patents by PatentIndex Score
54 records- 0187US10216082B2Layout design system, system and method for fabricating mask pattern using the sameKANG DAE KWON·Filed 2016·Granted Feb 26, 2019·5 cites·19 claims
- 0275US10790255B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·2 cites·17 claims
- 0375US8941220B2Power module package and system module having the sameKIM KWANG SOO·Filed 2012·Granted Jan 27, 2015·4 cites·13 claims
- 0469US10847474B2Semiconductor package and electromagnetic interference shielding structure for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·18 claims
- 0568US2024374766A1Container sterilization device using pulsed lightIUCF HYU·Filed 2024·Application pending·0 cites
- 0668US2024374767A1Container sterilization device using pulsed lightIUCF HYU·Filed 2024·Application pending·0 cites
- 0768US2024374768A1Container sterilization device using pulsed lightIUCF HYU·Filed 2024·Application pending·0 cites
- 0867US2024374771A1Container sterilization device using pulsed lightIUCF HYU INDUSTRY UNIV COORPERATION FOUNDATION HANYANG UNIV·Filed 2024·Application pending·0 cites
- 0966US8792239B2Power module package and method for manufacturing the sameSON JIN SUK·Filed 2011·Granted Jul 29, 2014·3 cites·6 claims
- 1065US11590801B2Composition for non-pneumatic tire spokeKUMHO TIRE CO INC·Filed 2018·Granted Feb 28, 2023·0 cites·7 claims
- 1165US8315056B2Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Granted Nov 20, 2012·1 cites·10 claims
- 1262US8603842B2Method of manufacturing package substrate for optical elementLIM CHANG HYUN·Filed 2012·Granted Dec 10, 2013·1 cites·8 claims
- 1361US2010153135A1Systems and methods for monitoring and rewarding patient compliancePARK SUNG K·Filed 2009·Application pending·0 cites
- 1461US2024026072A1Polyester-based Resin CompositionKOLON PLASTICS INC·Filed 2021·Application pending·0 cites
- 1560US8558359B2Semiconductor package having lead framesLIM CHANG HYUN·Filed 2012·Granted Oct 15, 2013·1 cites·18 claims
- 1659US9107313B2Method of manufacturing a hybrid heat-radiating substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·5 claims
- 1759US2014174940A1Heat-dissipating substrate and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1857US8686295B2Heat-dissipating substrate and fabricating method thereofLIM CHANG HYUN·Filed 2009·Granted Apr 1, 2014·0 cites·9 claims
- 1955US2025006606A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2055US2023100079A1Portable ipl sterilizer and ipl toilet bowl sterilizerIUCF HYU·Filed 2022·Application pending·0 cites
- 2155US2024203855A1Semiconductor packages and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2254US2013042963A1Heat-radiating substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2353US2010294543A1Heat dissipating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2009·Application pending·0 cites
- 2453US2024250008A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2552US2012273116A1Heat disspiating substrate and method of manufacturing the sameSOHN YOUNG HO·Filed 2012·Application pending·0 cites
- 2651US2024047319A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2749US2011303440A1Hybrid heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 2848US2011083885A1Metal wiring structure comprising electroless nickel plating layer and method of fabricating the sameKIM TAE HYUN·Filed 2009·Application pending·0 cites
- 2948US2011042699A1Substrate for light emitting diode package and light emitting diode package having the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3047US8502374B2Power module package and method for manufacturing the sameKIM KWANG SOO·Filed 2011·Granted Aug 6, 2013·0 cites·22 claims
- 3146US10643857B2Method of generating layout and method of manufacturing semiconductor devices using sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 5, 2020·0 cites·19 claims
- 3246US2010193940A1Wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3344US2015187726A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3444US2008249213A1Thermoplastic Polyetherester Elastomer Composition Having Excellent Flex Elasticity and Cover For Air-Bag Device TherebyKOLON INC·Filed 2006·Application pending·0 cites
- 3544US2011140144A1Package substrate for optical element and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 3643US7412176B2Method of processing an error of an image forming apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 12, 2008·2 cites·20 claims
- 3742US2012103588A1Heat-dissipating substrateKIM KWANG SOO·Filed 2011·Application pending·0 cites
- 3841US10923420B2Semiconductor device including dummy contactSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 3941US2013083492A1Power module package and method of manufacturing the sameKIM KWANG SOO·Filed 2012·Application pending·0 cites
- 4041US2011101392A1Package substrate for optical element and method of manufacturing the samePARK SUNG KEUN·Filed 2009·Application pending·0 cites
- 4141US2011303437A1Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 4240US10683391B2Thermoplastic elastomer resin composition for moisture-permeable waterproof film, film and fabric using sameKOLON INC·Filed 2015·Granted Jun 16, 2020·0 cites·7 claims
- 4340US2012073863A1Anodized heat-radiating substrate and method of manufacturing the sameKANG JUNG EUN·Filed 2011·Application pending·0 cites
- 4440US2007063999A1Systems and methods for providing an online lobbyHYPERPIA INC·Filed 2005·Application pending·0 cites
- 4539US2008120183A1Systems and methods for communicating personal informationPARK SUNG·Filed 2007·Application pending·0 cites
- 4638US11127692B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·12 claims
- 4737US2012111610A1Heat-radiating substrate and method for manufacturing the sameKIM KWANG SOO·Filed 2011·Application pending·0 cites
- 4835US9422644B2Thermoplastic poly-ether-ester elastomer resin composition and elastic monofilaments prepared therefromPARK SUNG KEUN·Filed 2011·Granted Aug 23, 2016·0 cites·15 claims
- 4935US2012000697A1Printed circuit board and method of manufacturing the sameKANG JUNG EUN·Filed 2010·Application pending·0 cites
- 5034US2005180766A1Developing method of liquid type electrophotographic image forming deviceFiled 2004·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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