Hybrid heat-radiating substrate and method of manufacturing the same

Abstract

Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

1 . A hybrid heat-radiating substrate, comprising:
 a metal core layer;   an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integral formed with the metal core layer;   an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer; and   a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer.   
     
     
         2 . The hybrid heat-radiating substrate as set forth in  claim 1 , wherein one side or two adjacent sides of the oxide insulating core layer are exposed to the outside. 
     
     
         3 . The hybrid heat-radiating substrate as set forth in  claim 1 , further comprising a protective layer formed on the circuit layer. 
     
     
         4 . The hybrid heat-radiating substrate as set forth in  claim 1 , wherein the first circuit pattern is mounted with thermally weakened elements and the second circuit pattern is mounted with heat generating elements. 
     
     
         5 . The hybrid heat-radiating substrate as set forth in  claim 1 , wherein the metal core layer is made of aluminum and the oxide insulating core layer and the oxide insulating layer are made of alumina. 
     
     
         6 . The hybrid heat-radiating substrate as set forth in  claim 1 , wherein the second circuit patterns are formed on both surfaces of the metal core layer and are connected to each other through a via. 
     
     
         7 . The hybrid heat-radiating substrate as set forth in  claim 1 , wherein the oxide insulating core layer is formed on both surfaces of the metal core layer. 
     
     
         8 . A method of manufacturing a hybrid heat-radiating substrate, comprising:
 providing a metal core member;   forming an oxide insulating core layer by performing volume anodizing on the metal core member in a thickness direction;   forming an oxide insulating layer by performing surface anodizing on one surface or both surfaces of the metal core member; and   forming a circuit layer that is configured to include first circuit patterns positioned on the oxide insulating core layer and second circuit patterns positioned on the oxide insulating layer.   
     
     
         9 . The method of manufacturing a hybrid heat-radiating substrate as set forth in  claim 8 , further comprising after the forming the circuit layer, forming a protective layer covering the circuit layer. 
     
     
         10 . The method of manufacturing a hybrid heat-radiating substrate as set forth in  claim 9 , further comprising after the forming the protective layer,
 mounting thermally weakened elements on the first circuit patterns formed on the oxide insulating core layer; and   mounting heat generating elements on the second circuit patterns formed on the oxide insulating layer.   
     
     
         11 . The method of manufacturing a hybrid heat-radiating substrate as set forth in  claim 8 , further comprising forming a via connecting the circuit layers formed on both surfaces of the metal core member. 
     
     
         12 . The method of manufacturing a hybrid heat-radiating substrate as set forth in  claim 11 , wherein the forming the via is performed by forming a through hole penetrating through the metal core member after forming the oxide insulating core layer, forming an insulating layer in an inner wall of the through hole at the forming the oxide insulating layer, and forming the plating layer in an inner wall of the insulating layer at the forming the circuit layer.