Inventor · disambiguated record
Dek-Gin Yang
Also filed as: YANG DEK G · YANG DEK GIN
39 granted patents·25 pending applications·310 citations·filing 2000–2020
98Inventor score
Top patents by PatentIndex Score
64 records- 0196US8882954B2Method of manufacturing rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·17 cites·23 claims
- 0292US9743529B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 22, 2017·9 cites·18 claims
- 0392US8558116B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameLEE YANG JE·Filed 2010·Granted Oct 15, 2013·13 cites·7 claims
- 0486US7453045B2Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 18, 2008·12 cites·6 claims
- 0586US6996305B2Printed circuit board with opto-via holes and process of forming the opto-via holesSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 7, 2006·32 cites·15 claims
- 0685US7281328B2Method of fabricating rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 16, 2007·20 cites·5 claims
- 0785US7033457B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2005·Granted Apr 25, 2006·13 cites·10 claims
- 0885US6839476B2Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jan 4, 2005·32 cites·74 claims
- 0983US10368445B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 30, 2019·2 cites·11 claims
- 1080US7203388B2Printed circuit board including waveguide and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 10, 2007·23 cites·12 claims
- 1179US10034368B2Flying tail type rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 24, 2018·2 cites·6 claims
- 1279US7347950B2Rigid flexible printed circuit board and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 25, 2008·14 cites·13 claims
- 1378US8759986B2Substrate structure and method of manufacturing the sameLEE CHUL MIN·Filed 2011·Granted Jun 24, 2014·4 cites·6 claims
- 1477US7999746B2Printed circuit board having built-in antennaSAMSUNG ELECTRO MECH·Filed 2008·Granted Aug 16, 2011·11 cites·3 claims
- 1576US7082679B2Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereofSAMSUNG ELECTRO MECH·Filed 2004·Granted Aug 1, 2006·17 cites·14 claims
- 1675US9955580B2Method of manufacturing rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 24, 2018·1 cites·13 claims
- 1774US10299373B2Method of manufacturing rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2018·Granted May 21, 2019·1 cites·20 claims
- 1872US8330048B2Electromagnetic bandgap structure and printed circuit board having the sameCHO WON WOO·Filed 2009·Granted Dec 11, 2012·5 cites·8 claims
- 1971US10674610B1Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 2, 2020·0 cites·10 claims
- 2071US6905569B2Method of embedding optical fiber in multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 14, 2005·13 cites·22 claims
- 2169US8711055B2Printed circuit board including electromagnetic bandgap structureCHO WON WOO·Filed 2009·Granted Apr 29, 2014·4 cites·8 claims
- 2267US7025849B2Method of attaching optical waveguide component to printed circuit boardSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 11, 2006·9 cites·10 claims
- 2367US6475299B1Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the sameSAMSUNG ELECTRO MECH·Filed 2000·Granted Nov 5, 2002·14 cites·23 claims
- 2465US10602616B2Multilayer rigid flexible printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 24, 2020·0 cites·11 claims
- 2565US7973619B2Electro-magnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2009·Granted Jul 5, 2011·3 cites·10 claims
- 2664US6879423B2Printed circuit board assembly with multi-channel block-type optical devices packaged thereinSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 12, 2005·11 cites·33 claims
- 2763US2015027627A1Method of manufacturing rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2861US7197202B2Optical printed circuit board for long-distance signal transmissionSAMSUNG ELECTRO MECH·Filed 2003·Granted Mar 27, 2007·7 cites·13 claims
- 2959US10091871B2Method of manufacturing rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 2, 2018·0 cites·20 claims
- 3059US8399777B2Electromagnetic bandgap structure and printed circuit board having the sameCHO WON WOO·Filed 2009·Granted Mar 19, 2013·1 cites·8 claims
- 3159US2018302979A1Flying tail type rigid-flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3258US7280716B2Printed circuit board including waveguide and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 9, 2007·2 cites·9 claims
- 3358US6978058B2Multi-layer PCB and method for coupling block type multichannel optical signalsSAMSUNG ELECTRO MECH·Filed 2003·Granted Dec 20, 2005·7 cites·44 claims
- 3458US2013213695A1Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3557US7981317B2Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 19, 2011·0 cites·8 claims
- 3657US7810232B2Method of manufacturing a circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 12, 2010·1 cites·4 claims
- 3757US7473099B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Jan 6, 2009·1 cites·4 claims
- 3855US7046870B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2003·Granted May 16, 2006·4 cites·4 claims
- 3955US2014021164A1Method for manufacturing a multilayer rigid flexible printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4051US2008121414A1Printed circuit board and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4150US2010288726A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4250US2010319980A1Printed circuit boardKIM HYUNG HO·Filed 2009·Application pending·0 cites
- 4350US2014191907A1Printed circuit board including electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4450US2010319982A1Electromagnetic wave shielding substrateCHO WON WOO·Filed 2009·Application pending·0 cites
- 4549US6882161B2Method of measuring dielectric constant of PCB for RIMMSAMSUNG ELECTRO MECH·Filed 2003·Granted Apr 19, 2005·4 cites·5 claims
- 4649US2010155108A1Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4748US2008209718A1Method of manufacturing multi-layered printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4848US2015212619A1Touch sensorSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4947US7350295B2Method of fabricating multi-layered printed circuit board for optical waveguidesSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 1, 2008·0 cites·28 claims
- 5047US2009277679A1Method of manufacturing PCB and PCB manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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