Method of manufacturing rigid-flexible printed circuit board

Abstract

A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

What is claimed is: 
     
         1 . A method of manufacturing a rigid-flexible printed circuit board, which comprises:
 providing a first flexible film having a first metal layer on one or both surfaces;   forming a circuit pattern by patterning the first metal layer;   forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film;   forming a circuit pattern by patterning the second metal layer in a rigid domain R;   providing an anti-oxidation protective layer on the second metal layer in a flexible domain F;   laminating at least one circuit layer on the second flexible film; and   removing the circuit layer in the flexible domain F.   
     
     
         2 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein the anti-oxidation protective layer is removed in removing the circuit layer in the flexible domain F. 
     
     
         3 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein the second metal layer corresponding to the flexible domain F is removed in removing the circuit layer in the flexible domain F. 
     
     
         4 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , further comprising:
 attaching a bonding sheet between the second metal layer and the anti-oxidation protective layer.   
     
     
         5 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein the anti-oxidation protective layer is made of an adhesive material including polyimide. 
     
     
         6 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein providing the anti-oxidation protective layer on the second metal layer in the flexible domain F is performed by applying slurry, which is made of an adhesive material including polyimide, on the second metal layer corresponding to the flexible domain F; and
 curing the slurry.   
     
     
         7 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , further comprising:
 providing a bonding sheet between the first flexible film and the second flexible film.   
     
     
         8 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein laminating the at least one circuit layer on the second flexible film laminates the circuit layer after oxidizing the circuit pattern under the circuit layer. 
     
     
         9 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 8 , wherein the circuit layer is formed by forming an insulating layer which covers the circuit pattern under the circuit layer; forming a metal layer on the insulating layer; and forming a circuit pattern by patterning the metal layer. 
     
     
         10 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 9 , wherein in forming the circuit pattern by patterning the metal layer, the metal layer in the flexible domain F is removed. 
     
     
         11 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 1 , wherein removing the circuit layer in the flexible domain F is performed by a CO 2  laser drilling process or a YAG laser drilling process. 
     
     
         12 . The method of manufacturing a rigid-flexible printed circuit board according to  claim 11 , wherein before the laser drilling process, a flexible domain F portion of the metal layer included in the uppermost circuit layer is removed.