Method for manufacturing a multilayer rigid flexible printed circuit board

Abstract

A method for manufacturing a multilayer rigid flexible printed circuit board that includes a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region.

What is claimed is: 
     
         1 . A method for manufacturing a multilayer rigid flexible printed circuit board comprising:
 providing a base substrate including a flexible film having a circuit pattern formed on one or both surfaces thereof;   forming a laser blocking layer to protect the circuit pattern of a flexible region of the base substrate;   stacking a plurality of pattern layers on at least one surface of the base substrate having the laser blocking layer formed thereon;   forming copper foil layers on upper surfaces of the plurality of pattern layers while interposing insulators therebetween and stacking an outer pattern layer having a via hole or a through hole formed therein;   performing laser processing by forming windows in the via hole or the through hole of the outer pattern layer and the flexible region; and   forming an outer circuit pattern by performing copper plating on the laser-processed outer pattern layer and etching portions of the copper plating layer.   
     
     
         2 . The method according to  claim 1 , wherein the providing the base substrate including the flexible film having the circuit pattern formed on the one or both surfaces thereof includes:
 providing the flexible film having a copper foil layer stacked on one or both surfaces thereof; and   forming the circuit pattern by etching the copper foil layer.   
     
     
         3 . The method according to  claim 1 , wherein the forming the laser blocking layer to protect the circuit pattern of the flexible region of the base substrate includes:
 coating an adhesive in the flexible region of the base substrate;   forming a polyimide layer on the adhesive; and   forming a copper foil layer on the polyimide layer.   
     
     
         4 . The method according to  claim 1 , wherein the forming the laser blocking layer to protect the circuit pattern of the flexible region of the base substrate includes:
 coating an adhesive in the flexible region of the base substrate;   forming a polyimide layer on the adhesive;   disposing an adhesive on the polyimide layer; and   forming a copper foil layer on the adhesive.   
     
     
         5 . The method according to  claim 1 , wherein in the stacking the plurality of pattern layers on the at least one surface of the base substrate having the laser blocking layer formed thereon, the plurality of pattern layers are formed by repeating the forming one pattern layer including the forming a copper foil layer while interposing at least one insulator and forming a via hole or a through hole in the insulator having the copper foil layer formed thereon and forming a circuit pattern by forming a copper plating layer on an upper surface of the insulator having the via hole or the through hole formed therein and etching portions of the copper plating layer. 
     
     
         6 . The method according to  claim 1 , wherein the performing the laser processing by forming the windows in the via hole or the through hole of the outer pattern layer and the flexible region includes:
 forming copper foil openings in the via hole or the through hole of the outer pattern layer and the flexible region by window etching; and   removing the insulator by irradiating laser through the copper foil openings.   
     
     
         7 . A method for manufacturing a multilayer rigid flexible printed circuit board comprising:
 providing a base substrate including a flexible film having a circuit pattern formed on one or both surfaces thereof;   forming an electromagnetic shielding layer on the one or both surfaces of the flexible film having the circuit pattern formed thereon to protect the circuit pattern and shield electromagnetic waves;   forming a laser blocking layer on the electromagnetic shielding layer or on the flexible film on which the electromagnetic shielding layer is not formed;   stacking a plurality of pattern layers on one or both surfaces of the base substrate having the laser blocking layer formed thereon;   forming copper foil layers on upper surfaces of the plurality of pattern layers while interposing insulators therebetween and stacking an outer pattern layer having a via hole or a through hole formed therein;   performing laser processing by forming windows in the via hole or the through hole of the outer pattern layer and a flexible region; and   forming an outer circuit pattern by performing copper plating on the laser-processed outer pattern layer and etching portions of the copper plating layer.   
     
     
         8 . The method according to  claim 7 , wherein in the forming the laser blocking layer on the electromagnetic shielding layer or on the flexible film on which the electromagnetic shielding layer is not formed, the laser blocking layer is formed on one or both surfaces of the base substrate. 
     
     
         9 . The method according to  claim 7 , wherein in the forming the electromagnetic shielding layer on the one or both surfaces of the flexible film having the circuit pattern formed thereon to protect the circuit pattern and shield electromagnetic waves, the electromagnetic shielding layer is formed on one or both surfaces with respect to the base substrate. 
     
     
         10 . The method according to  claim 7 , wherein the providing the base substrate including the flexible film having the circuit pattern formed on one or both surfaces thereof includes:
 providing the flexible film having a copper foil layer stacked on one or both surfaces thereof; and   forming the circuit pattern by etching portions of the copper foil layer.   
     
     
         11 . The method according to  claim 7 , wherein the forming the laser blocking layer or the electromagnetic shielding layer includes:
 disposing an adhesive in the flexible region of the base substrate;   forming a polyimide layer on the adhesive; and   forming a copper foil layer on the polyimide layer.   
     
     
         12 . The method according to  claim 7 , wherein the forming the laser blocking layer or the electromagnetic shielding layer includes:
 disposing an adhesive in the flexible region of the base substrate;   forming a polyimide layer on the adhesive;   disposing an adhesive on the polyimide layer; and   forming a copper foil layer on the adhesive.   
     
     
         13 . The method according to  claim 7 , wherein the performing the laser processing by forming the windows in the via hole or the through hole of the outer pattern layer and the flexible region includes:
 forming copper foil openings in the via hole or the through hole of the outer pattern layer and the flexible region by window etching; and   removing the insulator by irradiating laser through the copper foil openings.   
     
     
         14 . The method according to  claim 7 , wherein the laser blocking layer or the electromagnetic shielding layer is extended to a region where at least one of a via hole and a through hole of the pattern layer is formed. 
     
     
         15 . The method according to  claim 14 , wherein a via hole formed in the electromagnetic shielding layer is formed to an upper portion of the copper foil layer of the electromagnetic shielding layer, and a through hole formed in the laser blocking layer and the electromagnetic shielding layer is formed through the electromagnetic shielding layer, the laser blocking layer, and the base substrate.