Method of manufacturing flying tail type rigid-flexible printed circuit board and flying tail type rigid-flexible printed circuit board manufactured by the same

Abstract

The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.

What is claimed is: 
     
         1 . A method of manufacturing a flying tail type rigid-flexible printed circuit board, which comprises:
 providing a base substrate having a first inner circuit pattern layer on one or both surfaces;   laminating a first insulating layer on a rigid domain R of the base substrate;   laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and   removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer comprises a second insulating layer.   
     
     
         2 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , wherein the first insulating layer is made of a rigid insulator, and the second insulating layer is made of a flexible insulator. 
     
     
         3 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 2 , wherein the rigid insulator is cured no flow prepreg. 
     
     
         4 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , further comprising, after providing the base substrate having the first inner circuit pattern layer on one or both surfaces, attaching a coverlay to the first inner circuit pattern layer formed in the flexible domain F of the base substrate. 
     
     
         5 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , wherein removing the portion of the circuit layer, which corresponds to the flexible domain F, is performed through processing a cavity on an edge of the flexible domain F adjacent to the rigid domain R; and removing a circuit layer pile remaining after processing the cavity. 
     
     
         6 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 5 , wherein processing the cavity on the edge of the flexible domain F adjacent to the rigid domain R is performed by a laser method or a routing method. 
     
     
         7 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , wherein laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer is performed through laminating a metal layer which extends over the entire domain of the base substrate; forming a plating layer on the metal layer; forming a second inner circuit pattern layer by etching the metal layer and the plating layer along a circuit pattern; and laminating a second insulating layer, which extends over the entire domain of the base substrate, on the second inner circuit pattern layer. 
     
     
         8 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 7 , further comprising, after laminating the metal layer which extends over the entire domain of the base substrate, forming a via-hole by window-etching a portion of the metal layer to form a via-hole opening and irradiating laser to the via-hole opening. 
     
     
         9 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 7 , further comprising, after laminating the metal layer which extends over the entire domain of the base substrate, processing a through-hole which penetrates the entire first insulating layer and base substrate. 
     
     
         10 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , wherein providing the base substrate having the first inner circuit pattern layer on one or both surfaces is performed through providing a flexible film having a metal layer on one or both surfaces; and forming the first inner circuit pattern layer by etching the metal layer. 
     
     
         11 . The method of manufacturing a flying tail type rigid-flexible printed circuit board according to  claim 1 , further comprising, after laminating the at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer, forming an outer circuit pattern layer on the outermost top surface of the circuit layer. 
     
     
         12 . A flying tail type rigid-flexible printed circuit board comprising:
 a base substrate having a first inner circuit pattern layer on one or both surfaces;   a first insulating layer laminated on a rigid domain R of the base substrate; and   at least one circuit layer formed on the first insulating layer and comprising a second insulating layer.   
     
     
         13 . The flying tail type rigid-flexible printed circuit board according to  claim 12 , wherein the first insulating layer is made of a rigid insulator, and the second insulating layer is made of a flexible insulator. 
     
     
         14 . The flying tail type rigid-flexible printed circuit board according to  claim 13 , wherein the rigid insulator is cured no flow prepreg. 
     
     
         15 . The flying tail type rigid-flexible printed circuit board according to  claim 12 , further comprising:
 a coverlay attached to the first inner circuit pattern layer formed in a flexible domain F of the base substrate.   
     
     
         16 . The flying tail type rigid-flexible printed circuit board according to  claim 12 , wherein the circuit layer consists of a lower second inner circuit pattern layer; and the second insulating layer which covers the second inner circuit pattern layer. 
     
     
         17 . The flying tail type rigid-flexible printed circuit board according to  claim 12 , further comprising:
 an outer circuit pattern layer formed on the outermost top surface of the circuit layer.