Inventor · disambiguated record

Huei-Mei Yen

Also filed as: YEN HUEI-MEI

2 granted patents·32 citations·filing 2006–2011

62Inventor score

Technology areasH10W

Files withLIN MOU-SHIUNG1 MEGICA CORP1

Top patents by PatentIndex Score

2 records

0192US7947978B2Semiconductor chip with bond areaMEGICA CORP·Filed 2006·Granted May 24, 2011·27 cites·20 claims
0281US8304766B2Semiconductor chip with a bonding pad having contact and test areasLIN MOU-SHIUNG·Filed 2011·Granted Nov 6, 2012·5 cites·21 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →