Inventor · disambiguated record
Wei-Che Huang
Also filed as: HUANG WEI · HUANG WEI-CHE
33 granted patents·11 pending applications·98 citations·filing 1999–2025
96Inventor score
Files withMEDIATEK INC37CHANGJIANG RIVER SCIENT RESEARCH INSTITUTE2UNITED MICROELECTRONICS CORP2HUNG CHENG-CHOU1SHEN YU-CHUAN1
Top patents by PatentIndex Score
44 records- 0191US10483211B2Fan-out package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Nov 19, 2019·8 cites·28 claims
- 0291US9570399B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Feb 14, 2017·9 cites·18 claims
- 0389US10692789B2Stacked fan-out package structureMEDIATEK INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 0487US9257392B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2013·Granted Feb 9, 2016·7 cites·11 claims
- 0586US9543232B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2015·Granted Jan 10, 2017·4 cites·18 claims
- 0685US11450756B2Manufacturing method of semiconductor chipMEDIATEK INC·Filed 2020·Granted Sep 20, 2022·1 cites·3 claims
- 0783US9269664B2Semiconductor package with through silicon via interconnect and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Feb 23, 2016·6 cites·12 claims
- 0882US10790380B2Semiconductor chip and manufacturing method thereofMEDIATEK INC·Filed 2018·Granted Sep 29, 2020·2 cites·12 claims
- 0980US11728292B2Semiconductor package assembly having a conductive electromagnetic shield layerMEDIATEK INC·Filed 2020·Granted Aug 15, 2023·1 cites·18 claims
- 1075US12237401B2Semiconductor chipMEDIATEK INC·Filed 2022·Granted Feb 25, 2025·0 cites·11 claims
- 1175US9679842B2Semiconductor package assemblyMEDIATEK INC·Filed 2015·Granted Jun 13, 2017·2 cites·17 claims
- 1269US10727202B2Package structureMEDIATEK INC·Filed 2016·Granted Jul 28, 2020·1 cites·20 claims
- 1369US10199318B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Feb 5, 2019·1 cites·28 claims
- 1469US9190976B2Passive device cell and fabrication process thereofMEDIATEK INC·Filed 2013·Granted Nov 17, 2015·2 cites·16 claims
- 1568US6221772B1Method of cleaning the polymer from within holes on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 24, 2001·34 cites·6 claims
- 1667US11348900B2Package structureMEDIATEK INC·Filed 2020·Granted May 31, 2022·0 cites·17 claims
- 1766US9870980B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Jan 16, 2018·1 cites·6 claims
- 1865US9941260B2Fan-out package structure having embedded package substrateMEDIATEK INC·Filed 2016·Granted Apr 10, 2018·1 cites·26 claims
- 1965US9524948B2Package structureMEDIATEK INC·Filed 2013·Granted Dec 20, 2016·1 cites·12 claims
- 2064US8987851B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Mar 24, 2015·1 cites·9 claims
- 2159US11414415B26H-imidazo[4,5,1-ij]quinolone, synthesis method and use thereofUNIV HANGZHOU NORMAL·Filed 2020·Granted Aug 16, 2022·0 cites·13 claims
- 2257US10468341B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Nov 5, 2019·0 cites·28 claims
- 2356US9899261B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Feb 20, 2018·0 cites·23 claims
- 2455US9786560B2Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the sameMEDIATEK INC·Filed 2016·Granted Oct 10, 2017·0 cites·18 claims
- 2554US2023307316A1Semiconductor package with vapor chamber lidMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2653US2019252351A1Semiconductor package structure having an antenna pattern electrically coupled to a first redistribution layer (rdl)MEDIATEK INC·Filed 2019·Application pending·0 cites
- 2752US10332830B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Jun 25, 2019·0 cites·18 claims
- 2852US9712130B2Passive device cell and fabrication process thereofMEDIATEK INC·Filed 2015·Granted Jul 18, 2017·0 cites·16 claims
- 2951US9947624B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2016·Granted Apr 17, 2018·0 cites·21 claims
- 3051US9607894B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2015·Granted Mar 28, 2017·0 cites·9 claims
- 3151US9425098B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2015·Granted Aug 23, 2016·0 cites·12 claims
- 3248US2017098629A1Stacked fan-out package structureMEDIATEK INC·Filed 2016·Application pending·0 cites
- 3348US2017040266A1Fan-out package structure including antennaMEDIATEK INC·Filed 2016·Application pending·0 cites
- 3447US10217723B2Semiconductor package with improved bandwidthMEDIATEK INC·Filed 2017·Granted Feb 26, 2019·0 cites·18 claims
- 3547US2016329299A1Fan-out package structure including antennaMEDIATEK INC·Filed 2016·Application pending·0 cites
- 3645US6147007AMethod for forming a contact hole on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 14, 2000·11 cites·8 claims
- 3743US2015364549A1Semiconductor device with silicon carbide embedded dummy patternMEDIATEK INC·Filed 2014·Application pending·0 cites
- 3842US12352000B1Laboratory experiment system for breaching of debris-typed barrier damCHANGJIANG RIVER SCIENT RESEARCH INSTITUTE·Filed 2025·Granted Jul 8, 2025·0 cites·8 claims
- 3940US8816810B2Integrated circuit transformerHUNG CHENG-CHOU·Filed 2012·Granted Aug 26, 2014·0 cites·20 claims
- 4039US2006279563A1Method for calibrating flat panel displaySHEN YU-CHUAN·Filed 2005·Application pending·0 cites
- 4139US2024184960A1Calculation method for dike breach development processCHANGJIANG RIVER SCIENT RESEARCH INSTITUTE·Filed 2023·Application pending·0 cites
- 4237US2017098589A1Fan-out wafer level package structureMEDIATEK INC·Filed 2016·Application pending·0 cites
- 4337US2017141041A1Semiconductor package assemblyMEDIATEK INC·Filed 2016·Application pending·0 cites
- 4437US2017098628A1Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →