Inventor · disambiguated record
Tatsuyuki Okubo
Also filed as: OKUBO TATSUYUKI
10 granted patents·3 pending applications·43 citations·filing 2007–2025
87Inventor score
Files withRENESAS ELECTRONICS CORP5FASFORD TECH CO LTD3MAKI HIROSHI2Fukasawa shingo1OKUBO TATSUYUKI1
Top patents by PatentIndex Score
13 records- 0184US7629231B2Fabrication method of semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Dec 8, 2009·13 cites·8 claims
- 0283US8703583B2Fabrication method of semiconductor deviceMAKI HIROSHI·Filed 2009·Granted Apr 22, 2014·12 cites·21 claims
- 0383US7888141B2Manufacturing method for semiconductor integrated deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Feb 15, 2011·8 cites·24 claims
- 0473US8492173B2Manufacturing method for semiconductor integrated deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 23, 2013·2 cites·4 claims
- 0571US8460491B1Die bonder and bonding methodFukasawa shingo·Filed 2012·Granted Jun 11, 2013·6 cites·11 claims
- 0667US12374576B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·18 claims
- 0765US8372665B2Manufacturing method for semiconductor integrated deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Feb 12, 2013·1 cites·4 claims
- 0865US8003495B2Manufacturing method for semiconductor integrated deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Aug 23, 2011·1 cites·10 claims
- 0959US11569118B2Semiconductor manufacturing apparatus and manufacturing method for semiconductor deviceFASFORD TECH CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·4 claims
- 1054US2013299098A1Manufacturing method for semiconductor integrated deviceRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1151US8222050B2Manufacturing method for semiconductor integrated deviceMAKI HIROSHI·Filed 2011·Granted Jul 17, 2012·0 cites·4 claims
- 1249US2025285892A1Semiconductor Manufacturing Apparatus, Pushup Method, and Method for Manufacturing Semiconductor DeviceFASFORD TECH CO LTD·Filed 2025·Application pending·0 cites
- 1326US2013276989A1Paste applying apparatus and paste applying method, and die bonderOKUBO TATSUYUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →