Assignee
MAKI HIROSHI
JP·9 granted patents·1 pending application·58 citations·filing 2009–2012
Top patents by PatentIndex Score
10 records- 0191US8991681B2Die bonder and bonding methodMAKI HIROSHI·Filed 2012·Granted Mar 31, 2015·16 cites·1 claims
- 0290US8292159B2Fabrication method of semiconductor integrated circuit deviceMAKI HIROSHI·Filed 2011·Granted Oct 23, 2012·8 cites·4 claims
- 0388US8450150B2Manufacturing method of semiconductor integrated circuit deviceMAKI HIROSHI·Filed 2010·Granted May 28, 2013·9 cites·19 claims
- 0483US8703583B2Fabrication method of semiconductor deviceMAKI HIROSHI·Filed 2009·Granted Apr 22, 2014·12 cites·21 claims
- 0582US8211261B2Semiconductor manufacturing method of die pick-up from waferMAKI HIROSHI·Filed 2010·Granted Jul 3, 2012·5 cites·10 claims
- 0682US8074868B2Fabrication method of semiconductor integrated circuit deviceMAKI HIROSHI·Filed 2010·Granted Dec 13, 2011·4 cites·14 claims
- 0771US8561664B2Die bonder, pickup method, and pickup deviceMAKI HIROSHI·Filed 2010·Granted Oct 22, 2013·3 cites·10 claims
- 0867US8640943B2Fabrication method of semiconductor integrated circuit deviceMAKI HIROSHI·Filed 2012·Granted Feb 4, 2014·1 cites·7 claims
- 0951US8222050B2Manufacturing method for semiconductor integrated deviceMAKI HIROSHI·Filed 2011·Granted Jul 17, 2012·0 cites·4 claims
- 1038US2013068826A1Die Bonder and Bonding MethodMAKI HIROSHI·Filed 2012·Application pending·0 cites
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