Manufacturing method for semiconductor integrated device

Abstract

In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

1 - 36 . (canceled) 
     
     
         37 . A method for manufacturing a semiconductor integrated circuit device, comprising the steps of:
 (a) supplying a plurality of chips divided in individual chip regions while being arranged substantially in their original two-dimensional layout upon a wafer, to a chip treating apparatus with their back surfaces fixed to an adhesive tape; and   (b) vacuum-chucking a surface of a first chip out of the chips to a lower surface of a rubber chip of a chucking collet and peeling the adhesive tape from the back surface of the first chip in a state in which the adhesive tape over the back surface of the first chip is vacuum-chucked to an upper surface of a lower base,   the rubber chip containing elastomer as a principal component and having a hardness of 15 or higher and lower than 55.   
     
     
         38 . A method according to  claim 37 , wherein the hardness is 20 or higher and lower than 40. 
     
     
         39 . A method according to  claim 37 , wherein the elastomer is fluorine-containing rubber. 
     
     
         40 . A method according to  claim 37 , wherein the elastomer is a silicone-based elastomer. 
     
     
         41 - 91 . (canceled)