Inventor · disambiguated record
Christopher Daniel Manack
Also filed as: MANACK CHRISTOPHER · MANACK CHRISTOPHER D · MANACK CHRISTOPHER DANIEL
49 granted patents·20 pending applications·30 citations·filing 2009–2025
96Inventor score
Files withTEXAS INSTRUMENTS INC65HAN LICHENG MARSHAL1MANACK CHRISTOPHER D1STEPNIAK FRANK1TEXAS INSTRUMENTS DEUTSCHLAND1
Top patents by PatentIndex Score
69 records- 0193US11562949B2Semiconductor package including undermounted die with exposed backside metalTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 24, 2023·6 cites·29 claims
- 0293US10453817B1Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 22, 2019·7 cites·20 claims
- 0390US11380637B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 5, 2022·2 cites·23 claims
- 0489US11942386B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 26, 2024·2 cites·17 claims
- 0588US11387155B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 12, 2022·2 cites·24 claims
- 0682US12255115B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2024·Granted Mar 18, 2025·0 cites·21 claims
- 0780US10692830B2Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 23, 2020·2 cites·14 claims
- 0880US8866237B2Methods for embedding controlled-cavity MEMS package in integration boardMANACK CHRISTOPHER D·Filed 2012·Granted Oct 21, 2014·6 cites·16 claims
- 0979US2025029943A1Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1079US2025372454A1Efficient removal of street test devices during wafer dicingTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1179US2024421045A1Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1275US2025218886A1Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1373US12142586B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·22 claims
- 1473US11984418B2Method of forming brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2022·Granted May 14, 2024·0 cites·13 claims
- 1573US10566267B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2018·Granted Feb 18, 2020·1 cites·20 claims
- 1673US2024413114A1Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1772US11869820B2IC having a metal ring thereon for stress reductionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 9, 2024·0 cites·21 claims
- 1872US11587858B2Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 21, 2023·0 cites·17 claims
- 1972US2020020656A1Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 2071US12062597B2Three dimensional package for semiconductor devices and external componentsTEXAS INSTRUMENTS INC·Filed 2023·Granted Aug 13, 2024·0 cites·26 claims
- 2170US10424552B2Alloy diffusion barrier layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 24, 2019·0 cites·20 claims
- 2268US11594504B2Nickel alloy for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 28, 2023·0 cites·15 claims
- 2368US2022173062A1Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2467US12237219B2Contact with bronze material to mitigate undercutTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 2567US12203776B2Miniature sensor cavitiesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 21, 2025·0 cites·16 claims
- 2667US12074096B2Die attach surface copper layer with protective layer for microelectronic devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 27, 2024·0 cites·12 claims
- 2767US11978709B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2022·Granted May 7, 2024·0 cites·23 claims
- 2867US2023260839A1Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2966US12068221B2Plating for thermal managementTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 20, 2024·0 cites·11 claims
- 3066US10629334B2Nanostructure barrier for copper wire bondingTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 21, 2020·0 cites·10 claims
- 3166US2025164296A1Miniature sensor cavitiesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 3265US12394671B2Efficient removal of street test devices during wafer dicingTEXAS INSTRUMENTS INC·Filed 2022·Granted Aug 19, 2025·0 cites·15 claims
- 3364US11127515B2Nanostructure barrier for copper wire bondingTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 21, 2021·0 cites·15 claims
- 3464US7919842B2Structure and method for sealing cavity of micro-electro-mechanical deviceTEXAS INSTRUMENTS INC·Filed 2009·Granted Apr 5, 2011·2 cites·21 claims
- 3563US11631632B2Three dimensional package for semiconductor devices and external componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 18, 2023·0 cites·27 claims
- 3663US11011488B2Zinc-cobalt barrier for interface in solder bond applicationsTEXAS INSTRUMENTS INC·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 3763US2020321299A1Multilayers of nickel alloys as diffusion barrier layersTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 3863US2022005760A1Semiconductor die with conversion coatingTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 3962US11837518B2Coated semiconductor diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 5, 2023·0 cites·19 claims
- 4062US11362047B2Integrated system-in-package with radiation shieldingTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 4162US2023005807A1Zinc Layer For A Semiconductor Die PillarTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4261US11616038B2Interconnect for electronic deviceTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 28, 2023·0 cites·16 claims
- 4361US11410947B2Brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 4460US10714417B2Semiconductor device with electroplated die attachTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 14, 2020·0 cites·24 claims
- 4559US2025372548A1Inductor module with packaged semiconductor dieTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4658US11121076B2Semiconductor die with conversion coatingTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 4758US10734304B2Plating for thermal managementTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 4858US10607931B2Semiconductor device with electroplated die attachTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 31, 2020·0 cites·18 claims
- 4957US12512416B2Laser ablation for die separation to reduce laser splash and electronic deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 30, 2025·0 cites·24 claims
- 5057US11854922B2Semicondutor package substrate with die cavity and redistribution layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·24 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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