Inventor · disambiguated record
Ching-Huei Su
Also filed as: SU CHING-HUEI
28 granted patents·15 pending applications·416 citations·filing 1999–2009
97Inventor score
Top patents by PatentIndex Score
43 records- 0195US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 0294US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 0393US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 0491US7253519B2Chip packaging structure having redistribution layer with recessADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·57 cites·18 claims
- 0590US7446404B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·18 cites·8 claims
- 0681US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0778US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 0877US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0975US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 1072US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 1172US6265768B1Chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 24, 2001·19 cites·14 claims
- 1271US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 1370US6921716B2Wafer bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 26, 2005·16 cites·21 claims
- 1469US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 1561US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 1660US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 1756US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 1856US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 1955US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 2055US6221697B1Chip scale package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Apr 24, 2001·21 cites·4 claims
- 2153US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 2250US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 2350US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 2449US2007252275A1Chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2548US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 2648US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 2748US2005016859A1[process for fabricating bumps]Filed 2004·Application pending·0 cites
- 2847US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 2946US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 3045US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 3140US2005161812A1Wafer-level package structureFiled 2005·Application pending·0 cites
- 3239US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 3339US2003189260A1Flip-chip bonding structure and method thereofFiled 2003·Application pending·0 cites
- 3438US2004256737A1[flip-chip package substrate and flip-chip bonding process thereof]Filed 2004·Application pending·0 cites
- 3538US2003146191A1Etching method for nickel-vanadium alloyFiled 2003·Application pending·0 cites
- 3638US2004183195A1[under bump metallurgy layer]Filed 2004·Application pending·0 cites
- 3737US2003157791A1Process of fabricating bumpsFiled 2003·Application pending·0 cites
- 3837US2003157438A1Bump forming processFiled 2003·Application pending·0 cites
- 3937US2003189261A1Under-bump-metallurgy layerFiled 2003·Application pending·0 cites
- 4037US2003189249A1Chip structure and wire bonding process suited for the sameFiled 2003·Application pending·0 cites
- 4137US2003160335A1Flip chip interconnection structure and fabrication process thereofFiled 2003·Application pending·0 cites
- 4236US2003164552A1Under-ball metallic layerFiled 2002·Application pending·0 cites
- 4332US2002127779A1Chip scale package and manufacturing method thereofFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →