Inventor · disambiguated record
Jeffrey S. Leal
Also filed as: LEAL JEFFREY · LEAL JEFFREY S
11 granted patents·3 pending applications·105 citations·filing 2008–2015
89Inventor score
Files withINVENSAS CORP4VERTICAL CIRCUITS INC3CO REYNALDO2ANDREWS JR LAWRENCE DOUGLAS1BARRIE KEITH LAKE1
Top patents by PatentIndex Score
14 records- 0196US9196588B2EMI shieldINVENSAS CORP·Filed 2012·Granted Nov 24, 2015·44 cites·11 claims
- 0291US7843046B2Flat leadless packages and stacked leadless package assembliesVERTICAL CIRCUITS INC·Filed 2008·Granted Nov 30, 2010·21 cites·34 claims
- 0386US9171369B2Computer-aided detection (CAD) system for personalized disease detection, assessment, and tracking, in medical imaging based on user selectable criteriaLEAL JEFFREY·Filed 2011·Granted Oct 27, 2015·15 cites·17 claims
- 0481US8680687B2Electrical interconnect for die stacked in zig-zag configurationCO REYNALDO·Filed 2010·Granted Mar 25, 2014·7 cites·31 claims
- 0576US9153517B2Electrical connector between die pad and z-interconnect for stacked die assembliesCO REYNALDO·Filed 2011·Granted Oct 6, 2015·5 cites·19 claims
- 0673US8912661B2Stacked die assembly having reduced stress electrical interconnectsMCGRATH SCOTT·Filed 2010·Granted Dec 16, 2014·5 cites·24 claims
- 0773US8159053B2Flat leadless packages and stacked leadless package assembliesANDREWS JR LAWRENCE DOUGLAS·Filed 2010·Granted Apr 17, 2012·4 cites·27 claims
- 0871US9508689B2Electrical connector between die pad and z-interconnect for stacked die assembliesINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 0961US9147583B2Selective die electrical insulation by additive processLEAL JEFFREY S·Filed 2010·Granted Sep 29, 2015·2 cites·20 claims
- 1050US2015056753A1Semiconductor Die Having Fine Pitch Electrical InterconnectsINVENSAS CORP·Filed 2014·Application pending·0 cites
- 1147US2010140811A1Semiconductor die interconnect formed by aerosol application of electrically conductive materialVERTICAL CIRCUITS INC·Filed 2009·Application pending·0 cites
- 1246US9490230B2Selective die electrical insulation by additive processINVENSAS CORP·Filed 2015·Granted Nov 8, 2016·0 cites·20 claims
- 1345US2009068790A1Electrical Interconnect Formed by Pulsed DispenseVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1441US8829677B2Semiconductor die having fine pitch electrical interconnectsBARRIE KEITH LAKE·Filed 2011·Granted Sep 9, 2014·0 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →