Inventor · disambiguated record
Byung Yeol Park
Also filed as: PARK BYUNG YEOL
1 granted patent·2 pending applications·3 citations·filing 2008–2014
25Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0173US9698319B2LED package with lead terminals having protrusions of differing widths and method for fabricating the sameSEOUL SEMICONDUCTOR CO LTD·Filed 2013·Granted Jul 4, 2017·3 cites·14 claims
- 0251US2014306257A1Led package and method for fabricating the sameSEOUL SEMICONDUCTOR CO LTD·Filed 2014·Application pending·0 cites
- 0348US2011108866A1Led package and method for fabricating the sameSEOUL SEMICONDUCTOR COL LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →