Led package and method for fabricating the same

Abstract

An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.

1 . An LED A light emitting diode (LED) package, comprising:
 a base;   an LED chip disposed on the base;   an encapsulation member comprising a light-transmittable resin encapsulating the LED chip, the encapsulation member comprising a molded top surface; and   a housing exposing a top portion of the encapsulation member and encompassing a side surface of the encapsulation member.   
     
     
         2 . The LED package of  claim 1 , wherein the housing is transfer molded. 
     
     
         3 . The LED package as claimed in of  claim 2 , wherein the housing is light-transmittable. 
     
     
         4 . The LED package of  claim 3 , wherein the housing is a semitransparent housing comprising a diffuser adjusting a viewing angle of the LED package, wherein the diffuser is used as a reflector. 
     
     
         5 . The LED package of  claim 1 , wherein the top surface of the encapsulation member comprises a planar or lens shape. 
     
     
         6 . The LED package of  claim 1 , wherein the encapsulation member is transfer molded. 
     
     
         7 . A light emitting diode (LED) package, comprising:
 a base;   an LED chip disposed on the base;   an encapsulation member comprising a light-transmittable resin encapsulating the LED chip; and   a housing exposing a top portion of the encapsulation member and encompassing a side surface of the encapsulation member, wherein the housing is light-transmittable.   
     
     
         8 . The LED package of  claim 7 , wherein the housing comprises a semitransparent housing that includes a diffuser adjusting a viewing angle of the LED package, wherein the diffuser is used as a reflector. 
     
     
         9 . The LED package of  claim 7 , wherein the housing and the encapsulation member are transfer molded. 
     
     
         10 . The LED package of  claim 1 , wherein an upper surface of the base comprises at least one recess to receive the LED chip or a bonding pad. 
     
     
         11 . A method for fabricating a light emitting diode (LED) package, comprising:
 mounting an LED chip on a base;   forming a housing supporting the base; and   forming a light-transmittable encapsulation member encapsulating the LED chip, the housing encompassing a side surface of the encapsulation member,   wherein forming the encapsulation member comprises molding the encapsulation member using a mold to form a molded to surface on the encapsulation member.   
     
     
         12 . A method for fabricating a light emitting diode (LED) package, comprising:
 mounting an LED chip on a base;   forming a light-transmittable encapsulation member encapsulating the LED chip and supporting the base; and   forming a housing encompassing a side surface of the encapsulation member,   wherein forming the encapsulation member comprises molding the encapsulation member using a mold to form a molded to surface on the encapsulation member.   
     
     
         13 . The method of  claim 11 , wherein forming the housing comprises a transfer molding process. 
     
     
         14 . The method of  claim 13 , wherein forming the housing comprises using a molding material comprising a diffuser and a transparent resin. 
     
     
         15 . The method of  claim 14 , wherein the molding material is formed by mixing the diffuser and the transparent resin, and a mixing ratio of the diffuser is adjusted to change a viewing angle of the LED package. 
     
     
         16 . The method of  claim 14 , wherein the diffuser is at least one selected from the group consisting of TiO 2 , SiO 2 , ZnO, and Y 2 O 3 . 
     
     
         17 . The method of  claim 11 , wherein forming the encapsulation member comprises a transfer molding process. 
     
     
         18 . The method of  claim 11 , wherein forming the encapsulation member or the housing comprises a multiple transfer molding process. 
     
     
         19 . A light emitting diode (LED) package, comprising:
 a base;   an LED chip disposed on the base;   an encapsulation member comprising a light-transmittable resin encapsulating the LED chip; and   a housing exposing a top portion of the encapsulation member and encompassing a side surface of the encapsulation member,   wherein the housing is transfer molded.   
     
     
         20 . The LED package of  claim 19 , wherein the encapsulation member comprises a liquefied light-transmittable resin that is injected into a cavity formed in the housing.