Led package and method for fabricating the same

Abstract

A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.

What is claimed is: 
     
         1 . A light emitting diode (LED) package, comprising:
 a base comprising a first lead terminal and a second lead terminal;   the first lead terminal spaced apart from the second lead terminal in a first direction;   an LED chip disposed on the first lead terminal and electrically connected to the second lead terminal by a bonding wire;   a resin supporting the first lead terminal and the second lead terminal and exposing the LED chip;   wherein at least one of the first lead terminal and the second lead terminal having a protruding part in a second direction perpendicular to the first direction;   wherein the protruding part is exposed to outside of the LED package through the resin in the second direction.   
     
     
         2 . The LED package of  claim 1 , wherein the first lead terminal and the second lead terminal are exposed to the outside of the LED package in the first direction. 
     
     
         3 . The LED package of  claim 2 , wherein the exposed protruding part in the second direction is connected to the exposed part in the first direction following side of the LED package. 
     
     
         4 . The LED package of  claim 1 , wherein the first lead terminal and the second lead terminal comprise a flat-plate form. 
     
     
         5 . The LED package of  claim 1 , wherein each of the first lead terminal and the second lead terminal comprises a first surface and a second surface, and the first surface comprises larger surface area than the second surface. 
     
     
         6 . The LED package of  claim 5 , wherein the second surface has a shape similar to that of the first surface. 
     
     
         7 . The LED package of  claim 1 , wherein the resin is disposed on the first surfaces of the first lead terminal and the second lead terminal, and in a gap between the first lead terminal and the second lead terminal. 
     
     
         8 . The LED package of  claim 1 , wherein the resin is disposed on the side surface of the lead terminals in the second direction. 
     
     
         9 . The LED package of  claim 1 , wherein each of the first lead terminal and the second lead terminal comprises a pair of notches disposed adjacent to the protruding part, and
 wherein side surfaces of the notches contact the resin.   
     
     
         10 . The LED package of  claim 1 , wherein the resin further comprises a diffuser in order to perform as a reflector. 
     
     
         11 . The LED package of  claim 10 , wherein the diffuser comprises at least one selected from the group consisting of TiO 2 , SiO 2 , ZnO, Y 2 O 3 , and a mixture thereof. 
     
     
         12 . The LED package of  claim 1 , wherein the resin is white-colored. 
     
     
         13 . The LED package of  claim 1 , wherein an encapsulation member covers the LED chip includes a phosphor. 
     
     
         14 . The LED package of  claim 14 , wherein the encapsulation member comprises a convex top surface. 
     
     
         15 . The LED package of  claim 13 , wherein the encapsulation member includes a phosphor.