Inventor · disambiguated record
David Palagashvili
Also filed as: PALAGASHVILI DAVID
25 granted patents·11 pending applications·798 citations·filing 1997–2017
96Inventor score
Top patents by PatentIndex Score
36 records- 0197US6692903B2Substrate cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2000·Granted Feb 17, 2004·414 cites·49 claims
- 0295US6962644B2Tandem etch chamber plasma processing systemAPPLIED MATERIALS INC·Filed 2002·Granted Nov 8, 2005·108 cites·35 claims
- 0395US6818096B2Plasma reactor electrodeFiled 2001·Granted Nov 16, 2004·80 cites·15 claims
- 0494US8270141B2Electrostatic chuck with reduced arcingWILLWERTH MICHAEL D·Filed 2010·Granted Sep 18, 2012·26 cites·20 claims
- 0591US8880227B2Component temperature control by coolant flow control and heater duty cycle controlMAHADESWARASWAMY CHETAN·Filed 2011·Granted Nov 4, 2014·11 cites·21 claims
- 0691US6444040B1Gas distribution plateAPPLIED MATERIALS INC·Filed 2000·Granted Sep 3, 2002·56 cites·18 claims
- 0788US7832354B2Cathode liner with wafer edge gas injection in a plasma reactor chamberAPPLIED MATERIALS INC·Filed 2007·Granted Nov 16, 2010·13 cites·17 claims
- 0884US8419893B2Shielded lid heater assemblyWILLWERTH MICHAEL D·Filed 2009·Granted Apr 16, 2013·7 cites·15 claims
- 0984US7552736B2Process for wafer backside polymer removal with a ring of plasma under the waferAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·9 cites·10 claims
- 1083US8236133B2Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension biasKATZ DAN·Filed 2008·Granted Aug 7, 2012·13 cites·9 claims
- 1183US7879250B2Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injectionAPPLIED MATERIALS INC·Filed 2007·Granted Feb 1, 2011·7 cites·8 claims
- 1281US8840725B2Chamber with uniform flow and plasma distributionPALAGASHVILI DAVID·Filed 2010·Granted Sep 23, 2014·8 cites·17 claims
- 1380US8757603B2Low force substrate liftWILLWERTH MICHAEL D·Filed 2010·Granted Jun 24, 2014·5 cites·19 claims
- 1472US11322337B2Plasma processing system workpiece carrier with thermally isolated heater plate blocksAPPLIED MATERIALS INC·Filed 2017·Granted May 3, 2022·1 cites·20 claims
- 1572US8501626B2Methods for high temperature etching a high-K material gate structureLIU WEI·Filed 2008·Granted Aug 6, 2013·4 cites·13 claims
- 1671US8383002B2Method of processing a workpiece in a plasma reactor with independent wafer edge process gas injectionAPPLIED MATERIALS INC·Filed 2010·Granted Feb 26, 2013·2 cites·6 claims
- 1767US9362148B2Shielded lid heater assemblyWILLWERTH MICHAEL D·Filed 2013·Granted Jun 7, 2016·1 cites·15 claims
- 1864US11302520B2Chamber apparatus for chemical etching of dielectric materialsAPPLIED MATERIALS INC·Filed 2015·Granted Apr 12, 2022·1 cites·9 claims
- 1959US9443753B2Apparatus for controlling the flow of a gas in a process chamberPALAGASHVILI DAVID·Filed 2011·Granted Sep 13, 2016·1 cites·15 claims
- 2058US6120608AWorkpiece support platen for semiconductor process chamberAPPLIED MATERIALS INC·Filed 1997·Granted Sep 19, 2000·22 cites·32 claims
- 2157US10083816B2Shielded lid heater assemblyAPPLIED MATERIALS INC·Filed 2016·Granted Sep 25, 2018·0 cites·20 claims
- 2257US9639097B2Component temperature control by coolant flow control and heater duty cycle controlAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·0 cites·15 claims
- 2353US6369493B1Microwave plasma applicator having a thermal transfer medium between a plasma containing tube and a cooling jacketAPPLIED MATERIALS INC·Filed 1999·Granted Apr 9, 2002·9 cites·18 claims
- 2453US2009221150A1Etch rate and critical dimension uniformity by selection of focus ring materialAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 2551US2014034241A1Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGY G·Filed 2013·Application pending·0 cites
- 2648US2009221149A1Multiple port gas injection system utilized in a semiconductor processing systemHAMMOND IV EDWARD P·Filed 2008·Application pending·0 cites
- 2747US2013344701A1Methods for high temperature etching a high-k gate structureLIU WEI·Filed 2013·Application pending·0 cites
- 2847US2009274590A1Plasma reactor electrostatic chuck having a coaxial rf feed and multizone ac heater power transmission through the coaxial feedAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 2947US2017011891A1Etch rate and critical dimension uniformity by selection of focus ring materialAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 3044US8580693B2Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGEY G·Filed 2011·Granted Nov 12, 2013·0 cites·19 claims
- 3144US2008179287A1Process for wafer backside polymer removal with wafer front side gas purgeCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 3244US2008179288A1Process for wafer backside polymer removal and wafer front side scavenger plasmaCOLLINS KENNETH S·Filed 2007·Application pending·0 cites
- 3339US9070536B2Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surfaceAPPLIED MATERIALS INC·Filed 2012·Granted Jun 30, 2015·0 cites·18 claims
- 3439US2014151331A1Deposition shield for plasma enhanced substrate processingAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3536US2002134513A1Novel thermal transfer apparatusFiled 2001·Application pending·0 cites
- 3634US2011120651A1Showerhead assembly with improved impact protectionAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
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