Inventor · disambiguated record
Brian Smith
Also filed as: SMITH BRIAN · SMITH BRIAN A · SMITH BRIAN ASHLEY
7 granted patents·4 pending applications·66 citations·filing 2003–2011
84Inventor score
Top patents by PatentIndex Score
11 records- 0189US9640396B2Spin-on spacer materials for double- and triple-patterning lithographyLIN QIN·Filed 2010·Granted May 2, 2017·13 cites·19 claims
- 0273US6808942B1Method for controlling a critical dimension (CD) in an etch processTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 26, 2004·20 cites·24 claims
- 0365US8877430B2Methods of producing structures using a developer-soluble layer with multilayer technologyWASHBURN CARLTON ASHLEY·Filed 2011·Granted Nov 4, 2014·3 cites·18 claims
- 0462US7300883B2Method for patterning sub-lithographic features in semiconductor manufacturingTEXAS INSTRUMENTS INC·Filed 2004·Granted Nov 27, 2007·8 cites·19 claims
- 0562US7244654B2Drive current improvement from recessed SiGe incorporation close to gateTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 17, 2007·10 cites·20 claims
- 0660US7320927B2In situ hardmask pullback using an in situ plasma resist trim processTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 22, 2008·11 cites·20 claims
- 0749US2007166906A1Method to Reduce Transistor Gate to Source/Drain Overlap Capacitance by Incorporation of CarbonTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 0846US7199011B2Method to reduce transistor gate to source/drain overlap capacitance by incorporation of carbonTEXAS INSTRUMENTS INC·Filed 2003·Granted Apr 3, 2007·1 cites·19 claims
- 0943US2009042399A1Method for Dry Develop of Trilayer Photoresist PatternsSMITH BRIAN ASHLEY·Filed 2007·Application pending·0 cites
- 1039US2006292885A1Layout modification to eliminate line bending caused by line material shrinkageTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 1137US2009020791A1Process method to fabricate cmos circuits with dual stress contact etch-stop liner layersYU SHAOFENG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →