Inventor · disambiguated record
Naohide Takamoto
Also filed as: TAKAMOTO NAOHIDE
48 granted patents·43 pending applications·107 citations·filing 2007–2022
97Inventor score
Top patents by PatentIndex Score
91 records- 0192US8722517B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted May 13, 2014·7 cites·1 claims
- 0287US8986486B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 24, 2015·8 cites·3 claims
- 0382US8513816B2Film for flip chip type semiconductor back surface containing thermoconductive fillerTAKAMOTO NAOHIDE·Filed 2011·Granted Aug 20, 2013·5 cites·8 claims
- 0481US9478454B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Granted Oct 25, 2016·2 cites·1 claims
- 0581US8237294B2Dicing tape-integrated wafer back surface protective filmTAKAMOTO NAOHIDE·Filed 2010·Granted Aug 7, 2012·4 cites·5 claims
- 0679US10014235B2Underfill material, laminated sheet and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jul 3, 2018·3 cites·5 claims
- 0779US8648476B2Dicing tape-integrated wafer back surface protective filmNITTO DENKO CORP·Filed 2013·Granted Feb 11, 2014·3 cites·5 claims
- 0878USD589473SAdhesive film material for use in manufacturing semiconductorsNITTO DENKO CORP·Filed 2007·Granted Mar 31, 2009·23 cites·1 claims
- 0977US9768050B2Film for semiconductor back surface and its useNITTO DENKO CORP·Filed 2016·Granted Sep 19, 2017·2 cites·4 claims
- 1075US8766462B2Dicing tape-integrated wafer back surface protective filmNITTO DENKO CORP·Filed 2013·Granted Jul 1, 2014·2 cites·5 claims
- 1175US8643194B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 4, 2014·4 cites·10 claims
- 1274US8692389B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 8, 2014·3 cites·5 claims
- 1373US8492907B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 23, 2013·3 cites·8 claims
- 1473US7829441B2Thermosetting die-bonding filmNITTO DENKO CORP·Filed 2008·Granted Nov 9, 2010·5 cites·13 claims
- 1572US8703584B2Dicing tape-integrated film for semiconductor back surfaceMISUMI SADAHITO·Filed 2010·Granted Apr 22, 2014·4 cites·5 claims
- 1672US7611926B2Thermosetting die bonding filmNITTO DENKO CORP·Filed 2008·Granted Nov 3, 2009·6 cites·15 claims
- 1770US9085685B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 1869US8652938B2Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 18, 2014·2 cites·9 claims
- 1968US9074113B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 7, 2015·2 cites·5 claims
- 2068US8679931B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceASAI FUMITERU·Filed 2011·Granted Mar 25, 2014·3 cites·8 claims
- 2168US8420509B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 16, 2013·2 cites·6 claims
- 2267US8558397B2Dicing tape-integrated wafer back surface protective filmTAKAMOTO NAOHIDE·Filed 2012·Granted Oct 15, 2013·1 cites·5 claims
- 2366US9279064B2Manufacturing semiconductor device with film for forming protective layerNITTO DENKO CORP·Filed 2013·Granted Mar 8, 2016·1 cites·4 claims
- 2466US9202795B2Laminated film and use thereofODA TAKASHI·Filed 2012·Granted Dec 1, 2015·2 cites·3 claims
- 2566US8450189B2Film for flip chip type semiconductor back surfaceSHIGA GOJI·Filed 2011·Granted May 28, 2013·2 cites·8 claims
- 2664US9761475B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionNITTO DENKO CORP·Filed 2015·Granted Sep 12, 2017·1 cites·3 claims
- 2764US9679797B2Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 13, 2017·1 cites·4 claims
- 2862US9324616B2Method of manufacturing flip-chip type semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Apr 26, 2016·1 cites·3 claims
- 2961US9472439B2Reinforcing sheet and method for producing secondary mounted semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Oct 18, 2016·1 cites·7 claims
- 3061US8704382B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 22, 2014·1 cites·6 claims
- 3156US8841780B2Dicing tape-integrated wafer back surface protective filmNITTO DENKO CORP·Filed 2013·Granted Sep 23, 2014·0 cites·5 claims
- 3254US10211083B2Film for flip chip type semiconductor back surface and its useNITTO DENKO CORP·Filed 2014·Granted Feb 19, 2019·0 cites·4 claims
- 3354US9362156B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Granted Jun 7, 2016·0 cites·4 claims
- 3454US9293387B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceKOMOTO YUSUKE·Filed 2011·Granted Mar 22, 2016·1 cites·6 claims
- 3554US9050773B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jun 9, 2015·0 cites·4 claims
- 3653US9620403B2Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Apr 11, 2017·0 cites·8 claims
- 3753US2012028050A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceSHIGA GOJI·Filed 2011·Application pending·0 cites
- 3853US2024409786A1Protective sheet, method for producing electronic component, and method for producing glass piece forming display surface of display apparatusNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 3952US2014159254A1Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4052US2018346640A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 4151US8912665B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2012·Granted Dec 16, 2014·0 cites·4 claims
- 4249US9368421B2Under-fill material and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2015·Granted Jun 14, 2016·0 cites·8 claims
- 4349US2012208009A1Film for forming protective layerODA TAKASHI·Filed 2012·Application pending·0 cites
- 4448US2016172230A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 4548US2012028380A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 4647US8455302B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2012·Granted Jun 4, 2013·0 cites·4 claims
- 4747US8404522B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2011·Granted Mar 26, 2013·0 cites·5 claims
- 4847US2012028416A1Film for flip chip type semiconductor back surface and its useTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 4947US2017140974A1Laminated body and composite body; assembly retrieval method; and semiconductor device manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 5046US9035466B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted May 19, 2015·0 cites·3 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
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