Assignee
ODA TAKASHI
JP·11 granted patents·2 pending applications·16 citations·filing 2006–2012
Top patents by PatentIndex Score
13 records- 0171USRE43468EAlumina particles of high aspect ratio, alumina particle manufacturing method, resin composition, and resin composition manufacturing methodODA TAKASHI·Filed 2009·Granted Jun 12, 2012·1 cites·24 claims
- 0268US8895653B2Acrylic adhesive composition, and pressure-sensitive adhesive sheet employing the sameODA TAKASHI·Filed 2008·Granted Nov 25, 2014·1 cites·9 claims
- 0367US8614833B2Printer, printer driver, printing system, and print controlling methodODA TAKASHI·Filed 2006·Granted Dec 24, 2013·6 cites·15 claims
- 0466US9202795B2Laminated film and use thereofODA TAKASHI·Filed 2012·Granted Dec 1, 2015·2 cites·3 claims
- 0565US8298872B2Manufacturing method for semiconductor deviceODA TAKASHI·Filed 2010·Granted Oct 30, 2012·2 cites·8 claims
- 0665US8247890B2Wiring circuit structure and manufacturing method for semiconductor device using the structureODA TAKASHI·Filed 2010·Granted Aug 21, 2012·2 cites·10 claims
- 0765US8124457B2Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor elementODA TAKASHI·Filed 2009·Granted Feb 28, 2012·2 cites·12 claims
- 0863US8722765B2Alumina particle composite, method of manufacturing the alumina particle composite, resin composition and method of manufacturing the resin compositionODA TAKASHI·Filed 2012·Granted May 13, 2014·0 cites·13 claims
- 0959US9744588B2Melting furnace for producing metalODA TAKASHI·Filed 2012·Granted Aug 29, 2017·0 cites·6 claims
- 1049US2012208009A1Film for forming protective layerODA TAKASHI·Filed 2012·Application pending·0 cites
- 1146US8518745B2Method of manufacturing semiconductor device having a bumped wafer and protective layerODA TAKASHI·Filed 2012·Granted Aug 27, 2013·0 cites·4 claims
- 1243US8420510B2Method of manufacturing semiconductor deviceODA TAKASHI·Filed 2012·Granted Apr 16, 2013·0 cites·4 claims
- 1338US2012205820A1Encapsulating resin sheet and semiconductor device using the same, and manufacturing method for the semiconductor deviceODA TAKASHI·Filed 2012·Application pending·0 cites
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