Assignee
HAYASHI MIKI
JP·1 granted patent·2 pending applications·0 citations·filing 2009–2010
Top patents by PatentIndex Score
3 records- 0139US2012153508A1Thermosetting die-bonding filmHAYASHI MIKI·Filed 2009·Application pending·0 cites
- 0238US8415201B2Dicing tape-integrated film for semiconductor back surfaceHAYASHI MIKI·Filed 2010·Granted Apr 9, 2013·0 cites·4 claims
- 0326US2011057331A1Thermosetting die bonding film, dicing die bonding film and semiconductor deviceHAYASHI MIKI·Filed 2010·Application pending·0 cites
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