Inventor · disambiguated record
Gerald Ofner
Also filed as: OFNER GERALD
45 granted patents·14 pending applications·707 citations·filing 2001–2022
98Inventor score
Top patents by PatentIndex Score
59 records- 0198US10211182B2Package-on-package stacked microelectronic structuresINTEL IP CORP·Filed 2014·Granted Feb 19, 2019·47 cites·25 claims
- 0298US8878360B2Stacked fan-out semiconductor chipMEYER THORSTEN·Filed 2012·Granted Nov 4, 2014·71 cites·10 claims
- 0397US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0497US9663353B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2013·Granted May 30, 2017·29 cites·16 claims
- 0597US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 0696US9543224B1Hybrid exposure for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Jan 10, 2017·19 cites·25 claims
- 0796US9385105B2Semiconductor devicesINTEL DEUTSCHLAND GMBH·Filed 2013·Granted Jul 5, 2016·52 cites·8 claims
- 0896US8716859B2Enhanced flip chip packageMEYER THORSTEN·Filed 2012·Granted May 6, 2014·22 cites·13 claims
- 0993US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 1090US6710455B2Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·65 cites·15 claims
- 1189US7816235B2Semiconductor package and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 19, 2010·14 cites·12 claims
- 1289US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 1388US10903166B2Integrated circuit packagesGANESAN SANKA·Filed 2016·Granted Jan 26, 2021·5 cites·25 claims
- 1487US9059304B2Enhanced flip chip packageINTEL MOBILE COMM GMBH·Filed 2014·Granted Jun 16, 2015·6 cites·33 claims
- 1587US8754522B2Repairable semiconductor device and methodMEYER THORSTEN·Filed 2011·Granted Jun 17, 2014·8 cites·20 claims
- 1687US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 1786US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 1883US7994608B2Magnetically alignable integrated circuit deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 9, 2011·17 cites·25 claims
- 1982US10566309B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 18, 2020·3 cites·25 claims
- 2082US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 2180US9856136B2Chip arrangement and method for manufacturing a chip arrangementINTEL MOBILE COMM GMBH·Filed 2013·Granted Jan 2, 2018·5 cites·34 claims
- 2280US6683374B2Electronic component and process for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·30 cites·15 claims
- 2378US9056763B2Stress buffer layer for integrated microelectromechanical systems (MEMS)GEISSLER CHRISTIAN·Filed 2013·Granted Jun 16, 2015·5 cites·35 claims
- 2478US8357565B2Integrated circuit package and a method for forming an integrated circuit packageINFINENON TECHNOLOGIES AG·Filed 2010·Granted Jan 22, 2013·9 cites·21 claims
- 2578US7452747B2Semiconductor package with contact support layer and method to produce the packageINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 18, 2008·9 cites·8 claims
- 2677US9888577B2Passive electrical devices with a polymer carrierINTEL CORP·Filed 2014·Granted Feb 6, 2018·3 cites·20 claims
- 2776US9550670B2Stress buffer layer for integrated microelectromechanical systems (MEMS)INTEL IP CORP·Filed 2015·Granted Jan 24, 2017·2 cites·22 claims
- 2872US9472515B2Integrated circuit packageINTEL CORP·Filed 2014·Granted Oct 18, 2016·2 cites·13 claims
- 2972US8076180B2Repairable semiconductor device and methodMEYER THORSTEN·Filed 2008·Granted Dec 13, 2011·4 cites·16 claims
- 3070US7045881B2Electronic component with shielding and method for its productionINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 16, 2006·12 cites·12 claims
- 3168US11652084B2Flat lead package formation methodINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 16, 2023·0 cites·6 claims
- 3262US11302668B2Multi-purpose non-linear semiconductor package assembly lineINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 12, 2022·0 cites·10 claims
- 3362US9263376B2Chip interposer, semiconductor device, and method for manufacturing a semiconductor deviceINTEL MOBILE COMM GMBH·Filed 2013·Granted Feb 16, 2016·1 cites·25 claims
- 3458US10301176B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted May 28, 2019·0 cites·29 claims
- 3557US10150668B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2017·Granted Dec 11, 2018·0 cites·20 claims
- 3656US10522454B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2018·Granted Dec 31, 2019·0 cites·12 claims
- 3756US6940156B2Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 6, 2005·8 cites·18 claims
- 3855US7768137B2Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·1 cites·13 claims
- 3953US2023411254A1Molded power semiconductor package with gate connector featureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 4053US2009160053A1Method of manufacturing a semiconducotor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4152US10157869B2Integrated circuit packageINTEL CORP·Filed 2016·Granted Dec 18, 2018·0 cites·10 claims
- 4251US8610266B2Semiconductor device for radio frequency applications and method for making the sameCHAN KAI CHONG·Filed 2006·Granted Dec 17, 2013·1 cites·12 claims
- 4350US2006183306A1Method for producing an electronic component with shieldingINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 4449US10228725B2Flexible band wearable electronic deviceINTEL IP CORP·Filed 2016·Granted Mar 12, 2019·0 cites·18 claims
- 4548US8003448B2Semiconductor package and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2010·Granted Aug 23, 2011·0 cites·10 claims
- 4648US7566968B2Biosensor with smart card configurationSIEMENS AG·Filed 2005·Granted Jul 28, 2009·0 cites·10 claims
- 4748US2011291274A1Method of manufacturing a semiconductor deviceMEYER THORSTEN·Filed 2011·Application pending·0 cites
- 4843US6953992B2Electronic component with at least one semiconductor chip and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 11, 2005·1 cites·8 claims
- 4941US2013328191A1Cte adaption in a semiconductor packageMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 5041US2008122053A1Integrated Circuit Package and a Method for Forming an Integrated Circuit PackageOFNER GERALD·Filed 2008·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →