Inventor · disambiguated record
Minoru Takaya
Also filed as: TAKAYA MINORU
23 granted patents·10 pending applications·901 citations·filing 1979–2007
97Inventor score
Top patents by PatentIndex Score
33 records- 0198US6713162B2Electronic partsTDK CORP·Filed 2000·Granted Mar 30, 2004·151 cites·7 claims
- 0297US4322698ALaminated electronic parts and process for making the sameTAKAHASHI TETSUO·Filed 1979·Granted Mar 30, 1982·106 cites·10 claims
- 0392US7060350B2Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic partTDK CORP·Filed 2000·Granted Jun 13, 2006·75 cites·31 claims
- 0492US6808642B2Method for producing multilayer substrate and electronic part, and multilayer electronic partTDK CORP·Filed 2002·Granted Oct 26, 2004·62 cites·20 claims
- 0591US7081803B2Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and moduleTDK CORP·Filed 2004·Granted Jul 25, 2006·41 cites·6 claims
- 0690US6908960B2Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettinTDK CORP·Filed 2000·Granted Jun 21, 2005·58 cites·32 claims
- 0787US5530415AComposite winding type stacked-layer inductors including self inductive inductors and manual-inductive inductorsTDK CORP·Filed 1994·Granted Jun 25, 1996·48 cites·5 claims
- 0886US5225969AMultilayer hybrid circuitTDK CORP·Filed 1990·Granted Jul 6, 1993·75 cites·12 claims
- 0983US6915944B1Soldering flux, solder paste and method of solderingTDK CORP·Filed 2000·Granted Jul 12, 2005·29 cites·60 claims
- 1081US5428885AMethod of making a multilayer hybrid circuitTDK CORP·Filed 1993·Granted Jul 4, 1995·44 cites·2 claims
- 1180US4731297ALaminated components of open magnetic circuit typeTDK CORP·Filed 1985·Granted Mar 15, 1988·35 cites·9 claims
- 1278US5793276AOrganic PTC thermistorTDK CORP·Filed 1996·Granted Aug 11, 1998·32 cites·28 claims
- 1377US4730241ALaminated hybrid integrated DC-DC converterTDK CORP·Filed 1987·Granted Mar 8, 1988·34 cites·3 claims
- 1474US6749928B2Electronic parts and method producing the sameTDK CORP·Filed 2002·Granted Jun 15, 2004·18 cites·10 claims
- 1574US6028353AChip bead element and manufacturing method thereofTDK CORP·Filed 1998·Granted Feb 22, 2000·27 cites·10 claims
- 1674US5157576AComposite electric part of stacked multi-layer structureTDK CORP·Filed 1991·Granted Oct 20, 1992·28 cites·2 claims
- 1768US6793842B2Single-crystal ferrite fine powderSHOEI CHEMICAL IND CO·Filed 2001·Granted Sep 21, 2004·11 cites·3 claims
- 1867US7547975B2Module with embedded semiconductor IC and method of fabricating the moduleTDK CORP·Filed 2004·Granted Jun 16, 2009·14 cites·25 claims
- 1961US6872251B2Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic elementTDK CORP·Filed 2002·Granted Mar 29, 2005·4 cites·22 claims
- 2057US7402337B2Method for manufacturing spherical ceramic powderTDK CORP·Filed 2002·Granted Jul 22, 2008·4 cites·13 claims
- 2156US7167071B2Inductive device and method for producing the sameTDK CORP·Filed 2004·Granted Jan 23, 2007·5 cites·15 claims
- 2249US2005130447A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 2349US2005130446A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 2449US2005154110A1Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin compositionTDK CORP·Filed 2005·Application pending·0 cites
- 2549US2008044660A1Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boardsTDK CORP·Filed 2007·Application pending·0 cites
- 2648US7416795B2Method for manufacturing magnetic metal powder, and magnetic metal powderTDK CORP·Filed 2004·Granted Aug 26, 2008·0 cites·3 claims
- 2744US6827758B2Method for manufacturing magnetic metal powder, and magnetic metal powderTDK CORP·Filed 2002·Granted Dec 7, 2004·0 cites·29 claims
- 2843US2004202848A1Electronic parts and method producing the sameTDK CORP·Filed 2004·Application pending·0 cites
- 2940US2005003199A1Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boardsTDK CORP·Filed 2003·Application pending·0 cites
- 3038US2004265551A1Electronic component and process for manufacturing the sameTDK CORP·Filed 2004·Application pending·0 cites
- 3137US2003039101A1Module component, core substrate element assembly, multi-layer substrate, method of manufacturing core substrate element assembly, method of manufacturing multi-layer substrate, and method of manufacturing module componentTDK CORP·Filed 2002·Application pending·0 cites
- 3236US2003030994A1Substrate for electronic part and electronic partTDK CORP·Filed 2002·Application pending·0 cites
- 3336US2006180342A1Multilayer substrate and method for producing sameTAKAYA MINORU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →