Electronic parts and method producing the same

Abstract

The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

1 - 9  (canceled)  
     
     
         10  A method of producing electronic parts, comprising the steps of: 
 forming a resin or a compound material made by mixing powder-like functional materials with said resin into thin plates, and hardening it to be core substrate,  
 forming thin film conductors on at least one of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a vapor deposition process, and a sputtering process, followed by patterning,  
 forming the resin or the compound material made by mixing powder-like functional materials with the resin into prepreg like thin plates, alternately laminating half-hardened prepregs and the core substrates, and  
 subsequently hot-pressing and unifying into laminated parts.