US2005130447A1PendingUtilityA1
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition
Est. expiryDec 28, 2019(expired)· nominal 20-yr term from priority
Inventors:Minoru TakayaHisashi KobukeToshikazu EndoSeiji TakaharaToshiyuki AbeHiroshige OhkawaMasami SasakiKenichi Kawabata
H05K 1/165H05K 1/0326H05K 1/0373H01P 1/203H05K 2201/012H01P 1/20345H01P 7/084H01P 5/187H01P 7/082H01B 3/442H05K 9/0075H05K 2201/086H01P 5/10H01P 7/04H01Q 1/38H05K 2201/0209H05K 1/024H01P 5/185H05K 1/162H01P 1/2056Y10T428/31692Y10T428/31855C08K 3/00
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Claims
Abstract
A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
Claims
exact text as granted — not AI-modified1 - 86 . (canceled)
87 . A method for preparing a thermosetting polyvinylbenzyl ether resin composition, comprising the step of dissolving a polyvinylbenzyl ether compound in a solvent capable of dissolving the compound.
88 . A method for preparing a thermosetting polyvinylbenzyl ether resin composition, comprising the steps of dissolving a polyvinylbenzyl ether compound in a solvent capable of dissolving the compound, removing the solvent from the polyvinylbenzyl ether compound, and obtaining a composition comprising the thus treated polyvinylbenzyl ether compound.
89 . The method of claim 87 , wherein the composition cures into a product having a low dielectric dissipation factor.
90 . The method of claim 87 , wherein said solvent has a dielectric constant of 2 to 16.
91 . The method of claim 87 , wherein the polyvinylbenzyl ether compound has the following formula (1):
wherein R 1 denotes methyl or ethyl, R 2 denotes hydrogen or a hydrocarbon group of 1 to 10 carbon atoms, R 3 denotes hydrogen or a vinylbenzyl group in a molar ratio of hydrogen to vinylbenzyl from 60:40 to 0:100, and n is a number of 2 to 4.
92 . A thermosetting polyvinylbenzyl ether resin composition, obtained by the method of claim 87 , and wherein said composition cures into a product having a Q of at least 250 at a frequency of 2 GHz.Join the waitlist — get patent alerts
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