Inventor · disambiguated record
Daniel N. Sobieski
Also filed as: SOBIESKI DANIEL · SOBIESKI DANIEL N · SOBIESKI DANIEL NICHOLAS
19 granted patents·3 pending applications·39 citations·filing 2013–2022
91Inventor score
Top patents by PatentIndex Score
22 records- 0193US9941054B2Integration of embedded thin film capacitors in package substratesINTEL CORP·Filed 2016·Granted Apr 10, 2018·9 cites·15 claims
- 0287US10692847B2Inorganic interposer for multi-chip packagingINTEL CORP·Filed 2015·Granted Jun 23, 2020·7 cites·9 claims
- 0386US11322457B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2020·Granted May 3, 2022·2 cites·17 claims
- 0486US9420693B2Integration of embedded thin film capacitors in package substratesSANKMAN ROBERT L·Filed 2014·Granted Aug 16, 2016·7 cites·25 claims
- 0580US9899311B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2016·Granted Feb 20, 2018·2 cites·22 claims
- 0679US9633938B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2015·Granted Apr 25, 2017·2 cites·22 claims
- 0779US9520350B2Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layerTEH WENG HONG·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 0875US10375832B2Method of forming an interference shield on a substrateINTEL CORP·Filed 2015·Granted Aug 6, 2019·2 cites·12 claims
- 0973US12009318B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2022·Granted Jun 11, 2024·0 cites·23 claims
- 1072US10494700B2Method of fabricating a microelectronic substrateINTEL CORP·Filed 2017·Granted Dec 3, 2019·0 cites·11 claims
- 1170US9758845B2Microelectronic substrates having copper alloy conductive route structuresINTEL CORP·Filed 2014·Granted Sep 12, 2017·0 cites·20 claims
- 1270US9232686B2Thin film based electromagnetic interference shielding with BBUL/coreless packagesINTEL CORP·Filed 2014·Granted Jan 5, 2016·2 cites·12 claims
- 1361US9941219B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2014·Granted Apr 10, 2018·1 cites·12 claims
- 1454US10658307B2Control of warpage using ABF GC cavity for embedded die packageINTEL CORP·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 1553US2014353019A1Formation of dielectric with smooth surfaceARORA DEEPAK·Filed 2013·Application pending·0 cites
- 1651US10070537B2Formation of dielectric with smooth surfaceINTEL CORP·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
- 1749US2017318669A1Electronic package and method forming an electrical packageINTEL CORP·Filed 2017·Application pending·0 cites
- 1846US10103037B2Flexible microelectronic systems and methods of fabricating the sameINTEL CORP·Filed 2014·Granted Oct 16, 2018·0 cites·16 claims
- 1945US10885253B2System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environmentCOVENTOR INC·Filed 2019·Granted Jan 5, 2021·0 cites·21 claims
- 2045US2017064821A1Electronic package and method forming an electrical packageDarmawikarta Kristof·Filed 2015·Application pending·0 cites
- 2144US10026691B2Package substrate having noncircular interconnectsINTEL CORP·Filed 2016·Granted Jul 17, 2018·0 cites·13 claims
- 2244US9505610B2Device, system and method for providing MEMS structures of a semiconductor packageTEH WENG HONG·Filed 2013·Granted Nov 29, 2016·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →