Inventor · disambiguated record
Wen-Chung Chiang
Also filed as: CHIANG WEN-CHUNG
7 granted patents·6 pending applications·38 citations·filing 2006–2014
79Inventor score
Files withHIGH CONDUCTION SCIENT CO LTD4CHIANG WEN-CHUNG3TONG HSING ELECTRONIC INDUSTRIES LTD3MA VEEN1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
13 records- 0185US8308418B2High efficiency buffer stockerMA VEEN·Filed 2006·Granted Nov 13, 2012·31 cites·15 claims
- 0266US8431835B2Packaging device for an electronic element and method for making the sameCHIANG WEN-CHUNG·Filed 2010·Granted Apr 30, 2013·4 cites·15 claims
- 0359US9659801B2High efficiency buffer stockerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·1 cites·20 claims
- 0459US8549739B2Method of making circuit board moduleCHIANG WEN-CHUNG·Filed 2010·Granted Oct 8, 2013·2 cites·6 claims
- 0548US9125335B2Ceramic circuit board and method of making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2013·Granted Sep 1, 2015·0 cites·11 claims
- 0647US2014090825A1Liquid-cooled heat dissipating device and method of making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2013·Application pending·0 cites
- 0745US8898892B2Method of making circuit board moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2013·Granted Dec 2, 2014·0 cites·5 claims
- 0845US2013032450A1High efficiency buffer stockerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Application pending·0 cites
- 0943US2009152237A1Ceramic-Copper Foil Bonding MethodHIGH CONDUCTION SCIENT CO LTD·Filed 2008·Application pending·0 cites
- 1040US8461614B2Packaging substrate device, method for making the packaging substrate device, and packaged light emitting deviceCHIANG WEN-CHUNG·Filed 2010·Granted Jun 11, 2013·0 cites·11 claims
- 1140US2010307730A1Liquid-cooled heat dissipating device and method of making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
- 1240US2010288536A1Ceramic circuit board and method of making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
- 1334US2010236819A1Printed circuit board and method for making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →