Liquid-cooled heat dissipating device and method of making the same

Abstract

A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.

What is claimed: 
     
         1 . A liquid-cooled heat dissipating device comprising:
 a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds said liquid chamber;   a cover plate covering said liquid chamber and eutectic-bonded to said surrounding wall;   a liquid inlet spatially communicating with said liquid chamber; and   a liquid outlet spatially communicating with said liquid chamber;   wherein said surrounding wall of said chamber-confining body has a top open end eutectic-bonded to said cover plate, and a bottom open end opposite to said top open end, said chamber-confining body further having a base plate connected integrally to said bottom open end of said surrounding wall as one piece;   wherein said chamber-confining body is made of copper, said cover plate being a ceramic-copper plate that includes a ceramic substrate and two copper layers formed on two opposite surfaces of said ceramic substrate.   
     
     
         2 . The liquid-cooled heat dissipating device of  claim 1 , wherein said chamber-confining body further has a plurality of dividing walls connected to said surrounding wall and dividing said liquid chamber into a plurality of channels that are interconnected. 
     
     
         3 . The liquid-cooled heat dissipating device of  claim 2 , further comprising a plurality of thermally conductive elements disposed in said channels. 
     
     
         4 . The liquid-cooled heat dissipating device of  claim 3 , wherein said thermally conductive elements are copper balls.