Liquid-cooled heat dissipating device and method of making the same

Abstract

A liquid-cooled heat dissipating device includes a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds the liquid chamber, a cover plate covering the liquid chamber and sinter-bonded to the surrounding wall, a liquid inlet spatially communicating with the liquid chamber, and a liquid outlet spatially communicating with the liquid chamber. A method of making the liquid-cooled heat dissipating device is also disclosed.

1 . A liquid-cooled heat dissipating device comprising:
 a chamber-confining body confining a liquid chamber adapted to receive a liquid coolant, and having a surrounding wall that surrounds said liquid chamber;   a cover plate covering said liquid chamber and sinter-bonded to said surrounding wall;   a liquid inlet spatially communicating with said liquid chamber; and   a liquid outlet spatially communicating with said liquid chamber.   
     
     
         2 . The liquid-cooled heat dissipating device of  claim 1 , wherein said surrounding wall of said chamber-confining body has a top open end sinter-bonded to said cover plate, and a bottom open end opposite to said top open end, said chamber-confining body further having a base plate connected integrally to said bottom open end of said surrounding wall as one piece. 
     
     
         3 . The liquid-cooled heat dissipating device of  claim 2 , wherein said chamber-confining body and said cover plate are made of copper. 
     
     
         4 . The liquid-cooled heat dissipating device of  claim 2 , wherein said chamber-confining body is made of copper, said cover plate being a ceramic-copper plate that includes a ceramic substrate and two copper layers formed on two opposite surfaces of said ceramic substrate. 
     
     
         5 . The liquid-cooled heat dissipating device of  claim 1 , wherein said surrounding wall of said chamber-confining body has a top open end sinter-bonded to said cover plate, and a bottom open end opposite to said top open end, said chamber-confining body further having a base plate sinter-bonded to said bottom open end of said surrounding wall. 
     
     
         6 . The liquid-cooled heat dissipating device of  claim 5 , wherein said chamber-confining body and said cover plate are made of copper. 
     
     
         7 . The liquid-cooled heat dissipating device of  claim 5 , wherein each of said cover plate and said base plate of said chamber-confining body is a ceramic-copper plate that includes a ceramic substrate and two copper layers formed on two opposite surfaces of said ceramic substrate, said surrounding wall of said chamber-confining body being made of copper. 
     
     
         8 . The liquid-cooled heat dissipating device of  claim 1 , wherein said chamber-confining body further has a plurality of dividing walls connected to said surrounding wall and dividing said liquid chamber into a plurality of channels that are interconnected. 
     
     
         9 . The liquid-cooled heat dissipating device of  claim 8 , further comprising a plurality of thermally conductive elements disposed in said channels. 
     
     
         10 . The liquid-cooled heat dissipating device of  claim 9 , wherein said thermally conductive elements are copper balls. 
     
     
         11 . A method of making a liquid-cooled heat dissipating device, comprising:
 providing a surrounding wall surrounding a liquid chamber adapted to receive a liquid coolant;   providing a cover plate having an oxide layer; and   covering the liquid chamber with the cover plate and sinter-bonding the cover plate to the surrounding wall by placing the oxide layer in contact with a top open end of the surrounding wall.   
     
     
         12 . The method of  claim 11 , further comprising the steps of: providing a base plate having an oxide layer; covering the liquid chamber with the base plate and sinter-bonding the base plate to the surrounding wall by placing the oxide layer of the base plate in contact with a bottom open end of the surrounding wall. 
     
     
         13 . The method of  claim 11 , wherein the cover plate is made of copper. 
     
     
         14 . The method of  claim 11 , wherein the cover plate is a ceramic-copper plate that includes a ceramic substrate and two copper layers formed on two opposite surfaces of the ceramic substrate. 
     
     
         15 . The method of  claim 11 , wherein the oxide layer of the cover plate is formed by a thermal oxidation process. 
     
     
         16 . The method of  claim 11 , wherein the oxide layer of the cover plate is formed by a wet oxidation process. 
     
     
         17 . The method of  claim 16 , wherein the wet oxidation process employs an oxidizing solution containing an oxidizing agent. 
     
     
         18 . The method of  claim 15 , wherein the thermal oxidation process is conducted at a temperature ranging from 400° C. to 900° C. 
     
     
         19 . The method of  claim 11 , wherein the sinter-bonding of the cover plate to the surrounding wall of the chamber-confining body is conducted at a temperature ranging from 1065° C. to 1080° C.