Assignee
HIGH CONDUCTION SCIENT CO LTD
TW·0 granted patents·4 pending applications·0 citations·filing 2008–2010
Top patents by PatentIndex Score
4 records- 0143US2009152237A1Ceramic-Copper Foil Bonding MethodHIGH CONDUCTION SCIENT CO LTD·Filed 2008·Application pending·0 cites
- 0240US2010307730A1Liquid-cooled heat dissipating device and method of making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
- 0340US2010288536A1Ceramic circuit board and method of making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
- 0434US2010236819A1Printed circuit board and method for making the sameHIGH CONDUCTION SCIENT CO LTD·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →