Inventor · disambiguated record
Yoshihiro Inao
Also filed as: INAO YOSHIHIRO
39 granted patents·7 pending applications·228 citations·filing 2004–2015
97Inventor score
Top patents by PatentIndex Score
46 records- 0195USD552565SSupporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Oct 9, 2007·69 cites·1 claims
- 0292USD544452SSupporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Jun 12, 2007·50 cites·1 claims
- 0391US9308715B2Laminate and method for separating the sameTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Apr 12, 2016·10 cites·3 claims
- 0488US8882096B2Perforated support plateTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Nov 11, 2014·7 cites·16 claims
- 0586US7919394B2Method for thinning substrate and method for manufacturing circuit deviceTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Apr 5, 2011·11 cites·12 claims
- 0684US9627235B2Supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Apr 18, 2017·4 cites·13 claims
- 0784US8298365B2Sticking method and sticking apparatusIMAI HIROFUMI·Filed 2010·Granted Oct 30, 2012·7 cites·11 claims
- 0882US8080123B2Supporting plate, apparatus and method for stripping supporting plateNAKAMURA AKIHIKO·Filed 2011·Granted Dec 20, 2011·5 cites·11 claims
- 0981US7268061B2Substrate attaching methodTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Sep 11, 2007·25 cites·11 claims
- 1078US9048311B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·4 cites·5 claims
- 1178US8136564B2Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plateNAKAMURA AKIHIKO·Filed 2006·Granted Mar 20, 2012·5 cites·14 claims
- 1276US8080121B2Method of bonding, thinning, and releasing waferINAO YOSHIHIRO·Filed 2007·Granted Dec 20, 2011·5 cites·4 claims
- 1375US9272494B2Sticking apparatus and sticking methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Mar 1, 2016·1 cites·9 claims
- 1472US9238357B2Supporting member separation apparatus and supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Jan 19, 2016·2 cites·10 claims
- 1572US8148457B2Adhesive composition and film adhesiveASAI TAKAHIRO·Filed 2007·Granted Apr 3, 2012·2 cites·16 claims
- 1670US8167687B2Method of thinning wafer and support plateNAKAMURA AKIHIKO·Filed 2007·Granted May 1, 2012·3 cites·3 claims
- 1768US9492986B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Nov 15, 2016·2 cites·7 claims
- 1866US9352542B2Processing method and processing apparatusTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 31, 2016·2 cites·18 claims
- 1965US8186410B2Separating deviceNAKAMURA AKIHIKO·Filed 2008·Granted May 29, 2012·2 cites·16 claims
- 2063US8377256B2Stripping device and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2012·Granted Feb 19, 2013·1 cites·3 claims
- 2163US8302651B2Stripping device and stripping methodNAKADA KIMIHIRO·Filed 2011·Granted Nov 6, 2012·2 cites·7 claims
- 2262US7849905B2Stripping device and stripping apparatusTOKYO OHKA KOGYO CO LTD·Filed 2006·Granted Dec 14, 2010·1 cites·20 claims
- 2361US8449691B2Liquid solvent abutment unitNAKAMURA AKIHIKO·Filed 2008·Granted May 28, 2013·1 cites·6 claims
- 2461US6893172B2Developing apparatus and developing methodTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted May 17, 2005·6 cites·20 claims
- 2557US9682532B2Laminated body and method for separating laminated bodyKUBO ATSUSHI·Filed 2011·Granted Jun 20, 2017·1 cites·4 claims
- 2657US2010178497A1Adhesive composition, film adhesive, and process for production of the compositionASAI TAKAHIRO·Filed 2007·Application pending·0 cites
- 2752US7999052B2Process for producing an adhesive compositionTOKYO OHKA KOGYO CO LTD·Filed 2007·Granted Aug 16, 2011·0 cites·1 claims
- 2852US2009288780A1Perforated support plateNAKAMURA AKIHIKO·Filed 2007·Application pending·0 cites
- 2950US8931535B2Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plateNAKAMURA AKIHIKO·Filed 2012·Granted Jan 13, 2015·0 cites·4 claims
- 3050US2007062644A1Supporting plate, apparatus, and method for stripping supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Application pending·0 cites
- 3149US2009314438A1Supporting plate peeling apparatusTOKYO OHKA KOGYO CO LTD·Filed 2009·Application pending·0 cites
- 3248US8297331B2Separating apparatus and separating methodINAO YOSHIHIRO·Filed 2009·Granted Oct 30, 2012·0 cites·8 claims
- 3347US7237967B2Developing apparatus and methodTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Jul 3, 2007·0 cites·9 claims
- 3447US2012118511A1Laminate and method for separating the sameIMAI HIROFUMI·Filed 2011·Application pending·0 cites
- 3546US9484238B2Attachment methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Nov 1, 2016·0 cites·13 claims
- 3646US8426543B2Adhesive composition and adhesive filmASAI TAKAHIRO·Filed 2007·Granted Apr 23, 2013·0 cites·11 claims
- 3746US8354157B2Support plate, method for producing the same, and method for processing substrateTOKYO OHKA KOGYO CO LTD·Filed 2010·Granted Jan 15, 2013·0 cites·16 claims
- 3845US9653337B2Transport arm, transport apparatus and transport methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 16, 2017·0 cites·9 claims
- 3945US2009305617A1Support plate, carrier device, releasing device, and releasing methodTOKYO OHKA KOGYO CO LTD·Filed 2007·Application pending·0 cites
- 4044US9281225B2Substrate processing apparatus and substrate processing methodTOKYO OHKA KOGYO CO LTD·Filed 2012·Granted Mar 8, 2016·0 cites·5 claims
- 4144US2007128832A1Supporting plate, and method for attaching supporting plateTOKYO OHKA KOGYO CO LTD·Filed 2006·Application pending·0 cites
- 4243US9337074B2Attaching device and attaching methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 10, 2016·0 cites·12 claims
- 4343US8163836B2Adhesive composition and adhesive filmMISUMI KOICHI·Filed 2006·Granted Apr 24, 2012·0 cites·7 claims
- 4442US9548232B2Attaching apparatusTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Jan 17, 2017·0 cites·8 claims
- 4540US9962915B2Bonding method and bonding apparatusTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 8, 2018·0 cites·10 claims
- 4640US8097087B2Method of cleaning support plateMITAKE TATSUHIRO·Filed 2010·Granted Jan 17, 2012·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →