US2012118511A1PendingUtilityA1

Laminate and method for separating the same

Assignee: IMAI HIROFUMIPriority: Nov 15, 2010Filed: Nov 7, 2011Published: May 17, 2012
Est. expiryNov 15, 2030(~4.3 yrs left)· nominal 20-yr term from priority
H10P 72/7416H10P 72/7412H10P 72/744H10P 72/74H10P 72/7448B32B 43/006Y10T156/1158B32B 2457/14B32B 2310/0825Y10T428/31663Y10T156/1195B32B 38/10C08G 77/14H10P 72/7402H10P 52/00
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Claims

Abstract

A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure.

Claims

exact text as granted — not AI-modified
1 . A laminate, comprising:
 a supporter which transmits infrared;   a substrate supported by the supporter;   an adhesive layer via which the supporter and the substrate are attached to each other; and   a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure.   
     
     
         2 . The laminate of  claim 1 , wherein the infrared-absorbing structure is a Si—O bond, a Si—C bond, or a Ti—O bond. 
     
     
         3 . The laminate of  claim 1 , wherein the infrared-absorbing structure is a silsesquioxane structure, a siloxane structure, or an alkoxy titanium structure. 
     
     
         4 . The laminate of  claim 1 , wherein the compound is a polymer. 
     
     
         5 . The laminate of  claim 1 , wherein the infrared-absorbing structure is a structure which absorbs infrared with a wavelength in a range of 1 to 20 μm. 
     
     
         6 . The laminate of  claim 1 , wherein the supporter is made of silicon. 
     
     
         7 . A method for separating the supporter from the substrate in a laminate as set forth in  claim 1 , comprising emitting infrared to the separation layer via the supporter to denature the compound. 
     
     
         8 . The method of  claim 7 , wherein the separation layer has an area irradiated with infrared and an area not irradiated with infrared.

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